Subjects : lead-free solder
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2020 | 1700 V Full-SiC Half-bridge Power Module with Low Switching Loss Jung Dong Yun Electronic System-Integration Technology Conference (ESTC) 2020, pp.1-4 | 1 | 원문 |
| Journal | 2020 | Epoxy-based Interconnection Materials and Process Technology Trends for Semiconductor Packaging Eom Yong Sung 전자통신동향분석, v.35, no.4, pp.1-10 | 원문 | |
| Conference | 2013 | Thermally Activated Bumping Process using Sn3.0Ag0.5Cu Solder Powder for Low-Cost Interposers Choi Kwang-Seong International Symposium on Microelectronics (IMAPS) 2013, pp.420-423 | 0 | |
| Conference | 2012 | Fine-Pitch, Low-Volume SoP(Solder-on-Pad) Process Ho-Eun Bae Electronics Packaging Technology Conference (EPTC) 2012, pp.723-727 | 2 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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