ETRI-Knowledge Sharing Plaform

High Performance Organic Thin-Film Transistors (Otfts) First Stokes(S1) Poly(Methyl Methacrylate)(PMMA) Elastomer Substrate Inkjet Printing Vdf-Trfe Pentacene Thin-Film Transistors Gate Insulator Electrical Properties(I-V curve) Inkjet-Printed On/Off Current Ratio Channel Length Reverse Offset Printing Metal Interconnects Vinylidene Fluoride-Co-Hexafluoropropylene(Poly) Electronic Systems Organic Ferroelectric 3 V Plastic Substrate Ferroelectric Memory Ag Electrode Transfer Characteristics Zno Nanoparticle Short Channel Subthreshold Swing(SS) Gate Electrode Low-Cost Organic Field-Effect Electronic Circuit Elastomeric Substrate Dual-Gate Structure Subthreshold Voltage Monolithically Integrated Device Applications Device Characteristics Schottky Diode Active Layer Active Channel Surface Treatments Electrical Performance Bottom Contact Organic Vapor Nonvolatile Memory Devices Organic Inverters STRETCHABLE ELECTRONICS Hybrid Substrate Maximum Strain Low-Temperature Process Printing Technology Highly Stretchable Organic Transistor And Gate Via-Hole Organic-Inorganic Hybrid Output Characteristics Bending Radius Plasma-Enhanced Atomic Layer Deposition Two-Dimensional(2D) Electrical Characteristics Active Devices Memory Cell Solution-Processed Printing Method Electric Characteristics High Speed Supply Voltage Voltage Bias Enhancement-Mode Voltage Swing Source/Drain Electrodes Stretchable Substrate Silver Ink Metal Layer Charge Carriers Surface Roughness Rfid Tag Stress-Free Bottom Gate Nonvolatile Memory Transistors Oxide Tfts Organic Capacitor Metal Grids High Temperature Regioregular Poly(3-Hexylthiophene)(RR-P3HT) Defect Passivation Poly (Ethylene Glycol)(PEG) 20 Nm Printing Process Hybrid Thin Film Low Hysteresis Indium Gallium Zinc Oxide High Permittivity Acrylic Polymer High Mobility Charge Transport Full Swing Uv/Ozone Treatment Ambient Conditions High Reliability Spin Coating Basic Properties Soft Electronics Current On-Off Ratio Metal Electrode Pdms Elastomer Semiconductor Materials Cyclic Deformation Logic Circuit Wavy Structure Nanowire Electrodes Mechanically Flexible Scan Range Applied Voltage Hysteresis Behavior Semiconducting Layer Large Strains Complementary Circuits High Gain Eutectic Gallium-Indium Blend Ratio Hybrid-Type Dielectric Behavior N-Type Sonochemical Method Polymer Insulator Poly(Vinylidene Fluoride-Co-Trifluoroethylene) Channel Structure Flexible Nonvolatile Memory High Voltage Flexible Device Vapor Deposition Pressure Control Radius Of Curvature Insulator Layer Ring Oscillator Need For Silver Nanowires(AgNWs) Annealing Temperature 2d Semiconductors Polyimide Island Threshold Voltage Control Passive Radio Frequency Identification(RFID) Saturation Mobility Gate Leakage Current Zno Thin Films Room-Temperature Turn-On Voltage Complementary Inverters Organic Non-Volatile Memory Negative Shift Inverter Circuit High-Resolution Ferroelectric Polymer High-K Polymer Dielectric Subthreshold Slope(SS) Organic Devices Conjugated Polymer(PFO-co-MEH-PPV) Three Dimensional(3D) Low Voltage Operation Partial Dissolution Oscillation Frequency Work Function Deposition Steps Ag Surface Electronic Interconnection Hybrid Gate Dielectric Process Temperature High Strain Voltage Inverter Optical Microscope Wrinkled Surface Air Ambient Electrical Conductivity(EC) Annealing Atmosphere Conductive Paths Silicon Wire Mechanical Compression Excellent Performance Elastomer Composite Device Structure Read-Only Electronic Characteristics Surface Profile X-Ray Diffraction Pattern Specific Resistance Is Diffusion Dip-Coated Commercial Application 4.7 V Adhesion Properties O 3 Each Region Transmission Electron Microscopy(TEM) Propylene Glycol Mixed-Mode Silver Electrode Cross-Sectional Wurtzite Structure Spin Casting Highly Integrated Circuits Solvent Effect Polymeric Semiconductors Semiconductor Oxides Resistive Random Access Memory(RRAM) Negative Gate Voltage Oled Lighting Curing Temperature Blue Shift P-Type Metal-Oxide Semiconductor S/D Electrodes Flexible Electronic System Electrical Measurements Zno Semiconductor Transfer Process An Inverter Naphthalene-1 Gate Bias Stress Low Threshold Voltage Vacuum Electron Beam Evaporation Zno Nanorod Conducting Materials Low-Frequency Low-Temperature Solution Process Master Mold Flexible Thin Film Transistors Hysteresis-Free Hydrogen Annealing Threshold Voltage Shift Ag Nanopaste Optimum Blend Dry Transfer Amorphous Ingazno Multi-Channel Lift-Off Patterning Ag Nanoparticles Sol-Gel-Derived Chemical Degradation Low Operating Voltage Length Variation Depletion Mode Tft Array Complex Dielectric Constant Driving Forces Device Architecture Metal Source/Drain(S/D) Logic Inverter Mg-Doped Zno Injection Energy Quantum Well(QW) Flexible Oxide Thin-Film Transistors Large-Area Electronics Sodium Beta Alumina Remnant Polarization Frequency Domain(FD) Failure Mode High Charge Line Pitch Experimental Data Stretchable Displays Micrometer Scale Electrical Contact Complementary Devices Single-Sided Tft Display Drain Current Thermal Stability(TGA) Injection Barrier Applied Physics Electronic Skins Ag Ink 2-Ethoxyethanol Tensile Strain Pzt Films Mechanical Stability Flexible Display Oxide Channel Energy Barrier Passivation Layer Dielectric Films Surface Structure Interface States Single Substrate Memory Window Blend Film Charge Carrier Transport Polymer Dielectric Layer Surface Morphology Gate Dielectric Film Large Area Deposition Fine-Tuning Well-Balanced 4-Vinyl Phenol(Poly) Comprehensive Study Zinc Oxide Film Hybrid Dielectric Dielectric Thickness Integrated Electronics Low Power Consumption Higher Performance Memory Applications Amorphous Oxide Inversion Voltage Rigid Substrate Connection System Flexible And Transparent Input And Output Electrical And Mechanical Properties Single-Layer Polarization Effect Ac Voltage Improved Device Stability Generalized Langevin Equation Electrostatic Potential Circuit Configuration Spring-Like Undoped Zno Au Electrode Organic Semiconductor Material(OSC) Hysteresis Characteristics Polymeric Materials Ferroelectric Polarization Charge Carrier Mobility Self-Synthesized Buffer Layer Self-Assembling Mechanical Flexibility Stable Operation Hybrid Structure Synthesis And Characterization P-Channel Hole Injection Silicon Ribbon Organic Materials Film Density Treatment Method High On/Off Ratio Organic Memory Devices Electronics Device Growth Mechanism Deposition Method High Throughput(HTP) Reduction Behavior Fabrication And Characterization High Mechanical Strength Low Contact Resistance Optical Properties New Method Light Irradiation One-Step Synthesis Mg Doping Dual-Functional Deterministic Assembly Electronic Properties Electron Traps Operating Frequency Pentacene Transistors Polymer Semiconductors Si Devices Channel Layer Simple Method Practical Application Device Properties Drop-On-Demand(DOD) Real-World Integration Density Process Scheme Electrode Pattern Ag Nps Alternating Current(AC) Overlap Capacitance Metal Surface Semiconductor Processing Spatial Variation High Field-Effect Mobility Device Performance Dc Voltage Wearable Device Elastic Modulus Flexible Otfts Wavy Surface Sonochemical Process Patterning Technique Field Emission Fundamental Parameters Ultrasonic Methods Interface Layer Liquid Crystal Display(LCD) Aqueous Solution Alignment Precision Various Conditions Organic Circuits Change In Properties Local Stress Polarization Switching Hysteresis Properties Mechanical Transfer PQT-12 Top Gate Dielectric Integrated System Spin-Coated High Optical Transparency Phonon Frequencies Via Formation Organic Electronic Devices Single-Gate(SG) Si Nanomembranes Pentacene Layer Polymer Field-Effect Transistors Voltage Transfer Characteristic Sheet Resistance White Light Emission Atomic Force Microscope(AFM) High Crystallinity Single-Crystal Silicon Compensation Technology Mild Conditions Isolation Effect Light-Emitting Mechanical Durability Drain-Induced Barrier Lowering(DIBL) Charge Trapping Metal Films Coiled Structures Flexible Memory Flexural Rigidity Liquid Metal Alloy Growth Characteristics Memory Effect Active Matrix Non-Saturation Voltage Level Oscillatory Motion Large Gain Copper Interconnects Ferroelectric Gate Charge Injection Ga-Doped Zno Electroplating Process Printed Electrodes Manufacturing Cost Channel Width Design And Build Rigid Materials Nanofibrillated Cellulose(NFC) Grain Growth Transparent Electrode Stress Concentration Current Crowding Temperature Condition N-Channel Semiconductors 1 H Stable Performance Lift-Off Process Vacuum Filtration Flexible Substrate Membrane Filter Exposure Time Flexible Circuits Quantum Confinement Effects Nanosilver Paste Thermal Annealing Contact Geometry Well-Controlled Surface Energy Memory Array Ti Source Doping Ratio Inkjet Printer Ag Film And Logic Gates Transfer Printing Substrate Structure Metal Alloys Silicon Nanomembranes Conjugated Materials Pvk Film Drain Voltage Gate Driver Pre-Stretching Hydroxyl Group Zns Phosphor Low-Temperature Annealing All-Printed Elastic Film Liquid Phase Multi-Step Current Injection Scanning Electron Microscope Interconnect Structures On-Current Current-Voltage Characteristics Silicon Transistor 42 V Pt Electrode Diode Rectifier