ETRI-Knowledge Sharing Plaform

Planar Lightwave Circuit(PLC) Spot Size Converter(SSC) Silicon Nanowires(SiNWs) Silica-Based Waveguide Photodetector Coherent Receiver Arrayed Waveguide Grating(AWG) On-Chip Waveguide Structure Beam Propagation Method Temperature-Dependent Wavelength Shift Temperature Dependence Coherent Optical Orthogonal Frequency Division Multiplexing(CO-OFDM) Phase Error Silicon Wire Creative Technology Center Wavelength Crosstalk Reduction Chip Loss Directional Coupler(DC) Etched Silicon Electron Channeling Contrast Imaging Integrated Waveguide Polarization Dependent Loss Threading Dislocations(TDs) Te Mode Hybrid Integration Inp-Based Silicon Waveguide Surface Morphology Waveguide Photodiodes(WGPD) Inorganic-Organic Hybrid Materials Receiver Module Inas/Gaas Quantum Dot Ofdm Transmission Receiver Sensitivity Transimpedance Amplifier(TIA) Bonding Technology Optical Communications Silica Core Channel Waveguide Dual-Channel Fiber Coupling Measurement Setup Mode Volume Tm Mode 16 Quadrature Amplitude Modulation(16QAM) Core Width Metalorganic Chemical Vapor Deposition Random Phase Design And Fabrication Balanced Photodiode Atomically Flat Surface By-Pass Channel Estimation(CE) Coupling Strength Components Technology Distributed Feedback Laser Diode Etch-Stop Full Range Heat Cycle Test Heat Dissipation Light-Current More Or Less Optical Ofdm Plc Technology Resonance Frequency Response Measurement Short Pulse Laser Silicon Ring Resonator Silicon Surfaces Silica Waveguide Third-Order Threading Dislocation Density Nano-Fabrication 2d Beam Absorbing Layer Asynchronous Processor Current Characteristics Local Oscillator Indium Gallium Arsenide Long-Term Storage Low Temperature(LT) Multi-Channel Optical Transceiver Module Ofdm Signal Phase Offset Polarization Dependence Refractive Index Structure-Dependent Waveguide Ring Resonator Gaas Films III-V Applied Physics Annealing Process Continuous Wave(CW) Coupled With Carrier Frequency Offset Etching Technique Flip-Chip Technology Finite Difference Method Flip-Chip Bonding Frequency Domain(FD) Fabrication Process High Responsivity Height Accuracy Linear Increase Output Power National Defense Process Tolerance Phase Difference Plasma Etching Precision Control Promotion Strategy Silicon Photonics Soi Wafer Support Project Ultra-Large Two-Step Growth Wavelength Division Multiplexer(WDM-MUX) 5 Nm Approximation Errors Aluminum Gallium Arsenide Array Chip Bandwidth Measurement Baking Temperature Communication Applications Coupling With Dc Bias Full-Duplex(FuDu) Epitaxially Grown Force Microscopy Indium Gallium Phosphide Icp Etching Lattice Matched Mach-Zehnder Interferometer(MZI) Monolithic Integration Quantum Dot Laser Polarization Beam Splitter(PBS) Polymeric Materials Polymer Cladding Platform Development Real-Time Ring Resonator Filters Subcarrier Modulation Sub-Assembly Several Variables Surface Roughness Silicon-Based Sensor Node Ultralow Power(ULP) Absorption Layer Capacitively Loaded Chip-To-Chip Coupling Structure Distributed Feedback Lasers(DFBs) E-Beam Lithography Fabry-Perot Laser Diode Fabrication And Characterization Growth Temperature Hybrid Technique High Temperature Highly Strained Laser Applications Low Polarization Optimized Structure Optimized Design Polymer Materials Practical Use Power Penalty Photodetector Array Digital Signal Processor(DSP) Simple Method Slab Model Systematic Study Substrate Thickness Thermal Dependence Thermal Characteristics Thermal Barrier 20 Nm Atomic Force Microscope(AFM) Cladding Layer Coupling Characteristics Computational Efficiency Cmos-Compatible DP-QPSK Compound Semiconductor Gaas On Si Polarization Interleaving Optimal Thickness Photonic Wire Polymer Hybrid Silicon On Insulator(SOI) Smooth Surface Strained Layer Thermal Behavior Temperature-Independent Thermo-Optic Effect Travelling Wave Ubiquitous Computing Environment Thermal Cycle Annealing Active Devices Butt-Coupling Coupling Loss Digital Signal Processing Delay Line Frequency Offset Compensation Frequency Deviation High Order Very Large Scale Integration(VLSI) Offset Tolerance(OT) Optoelectronic Devices Polymer Resin Root Mean Square Value Strength Variation Time-Domain Thin Film Filter Temperature-Insensitive Wide Range Wafer-Scale Integration Advanced Modulation Formats Approximation Technique Coherent Optical Communication Digital Applications(APPs) Effective Index Method(EIM) Eye Patterns Fpga Implementation Intermodulation Distortion Large Area Intelligent Vehicle Material Quality Optimum Structure Optical Splitter Oscillation Period Show Through Second-Order Slot Waveguide Si Substrate Thermo-Optic Coefficient Transmitter And Receiver Wide Bandwidth Wavelength Deviation