ETRI-Knowledge Sharing Plaform

Planar Lightwave Circuit(PLC) Spot Size Converter(SSC) Silicon Nanowires(SiNWs) Silica-Based Waveguide Photodetector Coherent Receiver Arrayed Waveguide Grating(AWG) On-Chip Waveguide Structure Beam Propagation Method Temperature-Dependent Temperature Dependence Wavelength Shift Coherent Optical Orthogonal Frequency Division Multiplexing(CO-OFDM) Phase Error Silicon Wire Crosstalk Reduction Chip Loss Center Wavelength Creative Technology Directional Coupler(DC) Electron Channeling Contrast Imaging Etched Silicon Integrated Waveguide Polarization Dependent Loss Te Mode Threading Dislocations(TDs) Hybrid Integration Inp-Based Silicon Waveguide Surface Morphology Inorganic-Organic Hybrid Materials Receiver Module Waveguide Photodiodes(WGPD) Inas/Gaas Quantum Dot Ofdm Transmission Receiver Sensitivity Transimpedance Amplifier(TIA) Bonding Technology Optical Communications Silica Core Mode Volume Channel Waveguide Dual-Channel Fiber Coupling Measurement Setup Tm Mode 16 Quadrature Amplitude Modulation(16QAM) Core Width Metalorganic Chemical Vapor Deposition Random Phase Design And Fabrication By-Pass Atomically Flat Surface Balanced Photodiode Channel Estimation(CE) Coupling Strength Components Technology Distributed Feedback Laser Diode Etch-Stop Full Range Heat Cycle Test Heat Dissipation Light-Current More Or Less Nano-Fabrication Optical Ofdm Plc Technology Resonance Frequency Response Measurement Short Pulse Laser Silica Waveguide Silicon Ring Resonator Silicon Surfaces Third-Order Threading Dislocation Density Absorbing Layer Asynchronous Processor Current Characteristics Gaas Films III-V Indium Gallium Arsenide Long-Term Storage Local Oscillator Low Temperature(LT) Multi-Channel Ofdm Signal Phase Offset Optical Transceiver Module Polarization Dependence Refractive Index Structure-Dependent 2d Beam Waveguide Ring Resonator 5 Nm Annealing Process Applied Physics Carrier Frequency Offset Coupled With Continuous Wave(CW) Etching Technique Fabrication Process Finite Difference Method Flip-Chip Bonding Flip-Chip Technology Frequency Domain(FD) High Responsivity Height Accuracy Linear Increase National Defense Phase Difference Output Power Process Tolerance Plasma Etching Precision Control Promotion Strategy Silicon Photonics Soi Wafer Support Project Two-Step Growth Ultra-Large Wavelength Division Multiplexer(WDM-MUX) Coupling With Approximation Errors Array Chip Bandwidth Measurement Baking Temperature Aluminum Gallium Arsenide Communication Applications Dc Bias Epitaxially Grown Force Microscopy Full-Duplex(FuDu) Icp Etching Indium Gallium Phosphide Mach-Zehnder Interferometer(MZI) Lattice Matched Monolithic Integration Quantum Dot Laser Polarization Beam Splitter(PBS) Polymeric Materials Polymer Cladding Platform Development Real-Time Ring Resonator Filters Subcarrier Modulation Sub-Assembly Several Variables Surface Roughness Silicon-Based Sensor Node Ultralow Power(ULP) 20 Nm Practical Use Absorption Layer Chip-To-Chip Capacitively Loaded Coupling Structure Distributed Feedback Lasers(DFBs) E-Beam Lithography Fabrication And Characterization Fabry-Perot Laser Diode Growth Temperature Hybrid Technique High Temperature Highly Strained Low Polarization Laser Applications Optimized Structure Optimized Design Power Penalty Photodetector Array Polymer Materials Digital Signal Processor(DSP) Simple Method Slab Model Substrate Thickness Systematic Study Thermal Dependence Thermal Characteristics Thermal Barrier Atomic Force Microscope(AFM) Computational Efficiency Cmos-Compatible Coupling Characteristics Cladding Layer Compound Semiconductor DP-QPSK Gaas On Si Polarization Interleaving Optimal Thickness Photonic Wire Polymer Hybrid Silicon On Insulator(SOI) Strained Layer Smooth Surface Travelling Wave Thermal Behavior Temperature-Independent Thermo-Optic Effect Ubiquitous Computing Environment Butt-Coupling Very Large Scale Integration(VLSI) Active Devices Coupling Loss Delay Line Digital Signal Processing Frequency Offset Compensation Frequency Deviation High Order Offset Tolerance(OT) Optoelectronic Devices Polymer Resin Root Mean Square Value Strength Variation Time-Domain Thermal Cycle Annealing Thin Film Filter Temperature-Insensitive Wafer-Scale Integration Wide Range Material Quality Advanced Modulation Formats Approximation Technique Coherent Optical Communication Digital Applications(APPs) Effective Index Method(EIM) Eye Patterns Fpga Implementation Intermodulation Distortion Intelligent Vehicle Large Area Optimum Structure Optical Splitter Oscillation Period Show Through Second-Order Slot Waveguide Si Substrate Thermo-Optic Coefficient Transmitter And Receiver Wavelength Deviation Wide Bandwidth