ETRI-Knowledge Sharing Plaform

Silicon Photonics Photon Pairs Temperature Dependence Silicon Waveguide Arrayed Waveguide Grating(AWG) Temperature-Dependent Insertion Loss Optical Waveguides Four-Wave Mixing(Fwm) Photonic Crystal Waveguides Low Loss Photonic Integrated Circuits(PICs) Silicon Nanowires(SiNWs) Te Mode Microlens Array Refractive Index Temperature-Insensitive Fabrication Process Photonic Circuit Polymer-Based Waveguide Structure Alignment Tolerance Photo Lithography Low-Power Polymer Films 16-Channel Propagation Loss Switch Matrix Fabrication Method Grating Coupler Polymer Materials Cmos-Compatible Surface Plasmon Polariton(SPP) Optical Switches Optical Transmission Coupling Loss Single-Photon Source Thermal Annealing Transmission Spectra Group Index High Speed Potential Applications 3-Db Bandwidth Transmission Band Coupling Coefficient Conversion Efficiency(C.E.) Free-Standing Mode Volume Silicon Nitride Photon Sources Semiconductor Optical Amplifiers(SOAs) Simulation Results Tapered Waveguide Thin Film(TF) Bell State Core Width Design Parameters Low-Cost Mixing Efficiency Multimode Waveguide Random Phase Polymer Layer Photonic Components Wavelength Range Quantum Key Distribution Slot Waveguide Electronic Control High Dispersion Integrated Device Measurement Results Photonic Devices Phase Error Silicon Ring Resonator Silicon Wire Rejection Filters Band Edge Crosstalk Reduction Chip Loss Correlated Photon Double Layered High Performance High Tolerance Layer Structure Passive Alignment Silicon Carbide(3C-SiC) Optical Loss Annealing Process Dry Etching Processes Dispersion Effect Electron Leakage Initial Modulus Planar Lightwave Circuit(PLC) White-Light Interferometry Thermo-Optic Ultraviolet Lithography One-Dimensional Photonic Crystal Fabrication Tolerance Loss Analysis Mach-Zehnder Interferometer(MZI) Silicon-Based P-Gan Polymer Waveguide Polymeric Materials Waveguide Devices Chip-To-Chip High Efficiency Power Penalty Pump Wavelength 20 Nm Silicon Photonic Integrated Circuit Optical Switching Silicon Substrate Cladding Layer Control Circuit Channel Spacing Electron Blocking Fresnel Lens Array Gain-Clamped Semiconductor Optical Amplifier(GC-SOA) Wearable Strain Sensor Optoelectronic Integrated Circuit Optical Interconnection Optical Axis Transmission System Dispersion Engineering Design Rule Electron Current European Project Experimental Demonstration Element-Free Full Range Free Spectral Range(FSR) Gain Clamping High-Purity Koh Silicon Etching Model-Based Analysis Monitor Photodiodes Microring Resonators 40 Nm Resonance Frequency Resonant Coupling Rf Frequency Spot Size Converter(SSC) Strip Waveguide Polymeric Waveguide Polymer Plc Phase Shifter Practical Design Polyethylene Terephthalate Quartz Substrate Wavelength Converter Stripe Patterns Standard Single-Mode Fiber Uv-Cured Films Waveguide Films Waveguide Integrated Waveguide Ring Resonator Asymmetric Structure Accurate Measurement Optical Materials Optical Ring Resonator Transparent Nanocomposite Technological Research Band Pass Filter(BPF) Butyl Acrylate(BA) Channel Crosstalk Constant Voltage(CV) Energy Transfer Quantum States Etched Silicon Electronic Chips Highly Sensitive Hong-Ou-Mandel Interference Information And Communication Leakage Characteristics Light-Emitting Diode (Led) Model Parameter Multi-Channel 460 Nm Design Automation Strained Quantum Wells Photonic Interconnects Polarization Dependence Pin Diode Positional Tolerance Plasma-Assisted Wavelength Conversion Wire Bonding Two-Step Thermal Sensitivity Wavelength In The Visible Region Nanocomposite Film Optical Transport Output Power Optimum Distance Optic Property Simple And Direct Soi Wafer Axis Alignment Blocking Layer Current Leakage Complex Coupling Communication Device Chip Bonding Coarse Wavelength Division Multiplexing(CWDM) Different Wavelengths Experimental Measurements Electrical Power Consumption Electrical Wire Hole Concentration Itu Grid Interference Fringe Input Data Mixing Process Mode Analysis Mass Information Numerical Simulations Receiving Coil Reduced Pressure Chemical Vapor Deposition State Preparation Symmetric And Asymmetric Polarization-Insensitive Photo Resist Power Ratio Wireless Energy Promotion Strategy Vertical Bending Voltage Control Vertical Coupling 1560 Nm Switching System Packet Switching Three-Dimensional (3-D) Integration Thick Silicon Support Project 65 Nm Active Region All-Optical Signal Noise Filtering Optical Circuit Optical Network Time Modulation Small Footprint Real-Time Amplified Spontaneous Emission Active Element Bending Loss Coupling With Coil System Cell Size Differential Drive Dispersion Measurement Equivalent Circuit Model(ECM) Efficiency Characteristics Flexible And Transparent Group-Velocity Dispersion Hole Injection Highly Pure Interlayer Thickness High-Fidelity Index Profile Input And Output Input Signal Long-Range Surface Plasmon Lateral Misalignment Local Heaters Light Intensity Modulation Multimode Interference (Mmi) Couplers Multiple Channels Mobile Devices Modulation Of Light Intensity Spectral Distribution Spherical Lens Quantum Gate 1310 Nm Si Wafer Short-Length Several Variables Transverse Magnetic (Tm) Mode Temperature-Sensitive Triethylene Glycol Narrow Spaces Network On Chip(NoC) Optical Properties Optical Strain Sensor Optical Communication Systems Organic Materials Coupled Waveguide Transimpedance Amplifier(TIA) Blue Light-Emitting Diodes Bell'S Inequality Building Block Bending Radius Chip Area Complementary Metal-Oxide-Semiconductor(CMOS) Coupling Efficiency Controlled-Not Gate Design Considerations Design And Implementation Data Center Networks Deep-Ultraviolet (Duv) Lithography Fused Quartz E-Beam Lithography Efficiency Enhancement Frequency Doubling Fiber Bonding Gan Layers High Energy Efficiency Large-Scale Monolithically Integrated Mg Doping Minimum Width Maximum Likelihood Estimation(MLE) New Method Nonradiative Recombination Nonlinear Optical Polymers Spectral Intensity Spectral Amplitudes Silicon-On-Insulator Ring Resonator Phase Change Pump Power Pump Field Polarization-Maintaining Wireless Power Transmission(WPT) Signal Processing Spectral Properties Simple Method Temperature Sensitivity Transfer System Ultrahigh Temperature Wafer Dicing Active Layer Noise Sources Optical Coupling Optical Isolation Optical Platform Transmittance And Reflectance Thermal Control An Optical Fiber Coupled Magnetic Resonances Chromatic Dispersion Coefficient Coupling Characteristics Channel Selector Cost-Effective Fabrication Cnot Gate Direct Method Digital Camera Direct Comparison El Efficiency Elastomer Matrix Frequency Characteristics Far-Field Entangled Photon Gan-Based Ghz State Human Body Motion Impedance Matching Light-Emitting Diodes (Leds) Low Dark Current Laser Diode(LD) Mach-Zehnder Interferometry Maximum Power Transmission Eye Opening Numerical Analyses Reflected Light Stress-Whitening Nano-Silicon Polymer Substrate Power Splitters White-Light Interferometer 193 Nm Spin-Coated Tetraethylene Glycol Travelling Wave Temperature-Independent Ultimate Stress System Reconfiguration Nitride Layer Off-Chip Optical Characteristics Output Coupling Theoretical Analysis Time-Domain Silicon Layer Channel Waveguide Design Method Dry Film Resist Extinction Ratio Equivalent Model Electrical Characteristics Electrically Active Flexible Optical Waveguide Intra-Data Center Internal Quantum Efficiency Inorganic Material Information Transmission Low Voltage Key Aspects Koh Solution Lasing Threshold Low Coefficient Of Thermal Expansion(CTE) Lower Cost Magnetic Induction(MI) Resonant Frequency(Fr) Stand-Alone Simulation Tool Photon Coincidence V-Grooves 2 Mm Signal Transmission Thermal Expansion Properties Technology Foresight Nanoparticle Interfaces Optical Modulation Optical Devices Optical Attenuators Coupling Constant Theoretical Simulation All-Polymer Blue Leds Beam Propagation Bit Error Rate(And BER) Control Approach Doping Profile Dispersion Curve Enhanced Nonlinearity Fabry-Perot Cavity Fully Integrated Ge-On-Si Highly Transparent Yield Point Low Input Power Low Stress Lift-Off Process Low Noise Figure Modulation Efficiency Mobile Phone Ring Filter Small Strain Polarization-Dependent Wavelength Shift P-Type Gan Packaged Device Polarization Ratio Wavelength Deviation Variable Optical Attenuator(VOA) Thermal Effects Standard Deviation(STD) Show Through Stress-Optic Coefficient Si Substrate Temperature Tuning Transparent Film Transfer Efficiency Fluorinated Polymers