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Conference
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2025 |
Sequential Assembly of Micro-LEDs Utilizing Simultaneous Transfer and Bonding (SITRAB) Method
Jungho Shin
International Display Workshops (IDW) 2025, pp.1-3 |
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Conference
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2025 |
Reliability Analysis of Laser-Assisted Bonding with Compression (LABC) Using Non-Conductive Film (NCF) Containing Spherical h-BN Filler
Seong-Cheol Kim
International Symposium on Microelectronics and Packaging (ISMP) 2025, pp.1-1 |
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Conference
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2025 |
Selective Formation of Bonding Materials on Micro-bumps via Laser Non-conductive Film Dipping for 20 μm Pitch Interconnections
Jungho Shin
International Symposium on Microelectronics and Packaging (ISMP) 2025, pp.1-18 |
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Conference
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2025 |
Reliability Analysis of Fine-Pitch Interconnections Using Epoxy-Based Laser Bonding Materials with Different Glass Transition Temperatures
Ga-Eun Lee
International Symposium on Microelectronics and Packaging (ISMP) 2025, pp.1-1 |
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Conference
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2025 |
Fine-Pitch Flip-Chip Bonding Process with Laser Non-Conductive Paste (NCP) and Laser-Assisted Bonding (LAB) for High-Reliability
Ki-Seok Jang
European Microelectronics and Packaging Conference (EMPC) 2025, pp.1-5 |
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Conference
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2025 |
A Novel Photo-Patternable Epoxy Flux Material for A New Horizon in Fine Pitch Flip-Chip Interconnections
Gwang-Mun Choi
European Microelectronics and Packaging Conference (EMPC) 2025, pp.1-5 |
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Journal
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2025 |
Reliability Enhancement of 30 μm-Pitch Interconnections via Room-Temperature Laser-Assisted Bonding with Compression (LABC) Using Optimized Laser Non-Conductive Paste (LNCP)
이가은
Journal of Korean Institute of Metals and Materials, v.63, no.8, pp.583-593 |
0 |
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Conference
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2025 |
Localized application of bonding material onto 20 μm-pitch solder bumps via laser non-conductive film dipping
신정호
대한전자공학회 학술 대회 (하계) 2025, pp.1-3 |
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Conference
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2025 |
Photo-Patternable Epoxy Flux Material Technology for Flip-Chip Bonding
최광문
대한전자공학회 학술 대회 (하계) 2025, pp.1-2 |
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