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Conference
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2024 |
Simultaneous Transfer and Bonding (SITRAB) Technology for Micro-LED Display Fabrication
Jungho Shin
International Display Workshops (IDW) 2024, pp.1093-1095 |
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Conference
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2024 |
Low-Carbon Epoxy-Siloxane Flux Technology for Fine-Pitch Solder Bump Interconnection
Gwang-Mun Choi
International Symposium on Microelectronics and Packaging (ISMP) 2024, pp.164-164 |
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Conference
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2024 |
Simultaneous Transfer and Bonding (SITRAB) Technology for Integrating Micro-LEDs onto Display Backplanes
Jungho Shin
International Symposium on Microelectronics and Packaging (ISMP) 2024, pp.1-15 |
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Conference
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2024 |
Laser Assisted Bonding (LAB) technology using Laser Non-Conductive Paste (NCP) for Micro solder bumps
Ki-Seok Jang
International Symposium on Microelectronics and Packaging (ISMP) 2024, pp.272-272 |
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Conference
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2024 |
Enhancing Reliability of 30μm-Pitch Interconnections Using Room Temperature Laser-Assisted Bonding with Compression (LABC) with Laser Non-Conductive Paste (LNCP)
Gaeun Lee
International Symposium on Microelectronics and Packaging (ISMP) 2024, pp.1-14 |
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Conference
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2024 |
Heat dissipation evaluation of epoxy-boron nitride-based non-conductive films with high thermal conductivity for fine-pitch solder bump interconnection
J.H. Oh
European Materials Research Society (E-MRS) Meeting 2024 (Fall), pp.1-1 |
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Conference
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2024 |
Sustainable Epoxy-Functionalized Vanillic Acid-Siloxane Nanocomposite Adhesive for Fine-Pitch Solder Bump Interconnection
G.M. Choi
European Materials Research Society (E-MRS) Meeting 2024 (Fall), pp.1-1 |
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Conference
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2024 |
Laser Assisted Bonding (LAB) based Flip-chip process for fine pitch solder bumps device using Laser Non-Conductive Paste (NCP)
Ki-Seok Jang
Electronic System-Integration Technology Conference (ESTC) 2024, pp.1-4 |
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Journal
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2024 |
Polarity Control of Siloxane Composite Films for Triboelectric Nanogenerator based Self-Powered Body Temperature Monitoring
Seung-Mo Kang,
Jung Ho Shin
Nano Energy, v.127, pp.1-11 |
0 |
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Conference
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2024 |
Micro-LED Bonding and Repair on Display Backplanes by Simultaneous Transfer and Bonding (SITRAB) Technology
Jungho Shin
International Meeting on Information Display (IMID) 2024, pp.1-1 |
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Conference
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2024 |
Micro-LED display fabrication method using simultaneous transfer and bonding (SITRAB) technology
신정호
대한전자공학회 학술 대회 (하계) 2024, pp.3346-3347 |
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Conference
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2024 |
Never drying solder paste at room temperature for semiconductor packaging process
엄용성
대한전자공학회 학술 대회 (하계) 2024, pp.3344-3345 |
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Conference
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2024 |
Chip-on-Wafer (CoW) Technology Utilizing LaserAssisted Bonding with Compression (LABC) for Bump Counts Exceeding 500,000 at a 20m Pitch
Kwang-Seong Choi
Electronic Components and Technology Conference (ECTC) 2024, pp.943-948 |
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Conference
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2024 |
Development of a Full-Color MicroLED Display Utilizing Novel Simultaneous Transfer and Bonding (SITRAB) Process and SITRAB Film Technology
Jiho Joo
Society for Information Display (SID) International Symposium 2024, pp.1309-1312 |
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Conference
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2024 |
Transfer, Bonding, and Repair of LEDs for µLED Display Fabrication via Simultaneous Transfer and Bonding (SITRAB) Technology
Jungho Shin
Society for Information Display (SID) International Symposium 2024, pp.1278-1281 |
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Conference
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2024 |
Process window of Laser Non-Conductive Paste for Flip-chip Laser-Assisted Bonding
엄용성
한국마이크로전자 및 패키징학회 학술 대회 2024, pp.43-43 |
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Conference
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2024 |
Transfer, bonding, repair of LEDs via simultaneous transfer and bonding (SITRAB) technology
신정호
한국마이크로전자 및 패키징학회 학술 대회 2024, pp.1-1 |
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Conference
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2023 |
Highly reliable Mini-LED display module using simultaneous transfer and bonding (SITRAB) technology
Jiho Joo
International Meeting on Information Display (IMID) 2023, pp.1-1 |
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Conference
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2023 |
Laser-Assisted Bonding with Compression (LABC) based Tiling Bonding Technology, Enabling Technology for Chiplet Integration
Kwang-Seong Choi
Electronic Components and Technology Conference (ECTC) 2023, pp.1385-1389 |
3 |
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Conference
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2023 |
Development of Bonding Technology of HBM2-Level Stacked Chip with Reliability using Developed Electroplating Materials
엄용성
한국표면공학회 학술 대회 (춘계) 2023, pp.70-70 |
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