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Conference
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2016 |
Cooperative Big Data Processing Engine for Fast Reaction in Internet of Things Environment: Greater Than the Sum of Its Parts
Yong-Ju Lee
International Conference on Mobile and Wireless Technology (ICMWT) 2016 (LNEE 391), v.391, pp.145-149 |
6 |
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Conference
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2016 |
A 100W Wireless Charging System with a Human Protection Function from EM Field Exposure
Seong-Min Kim
IEEE Transportation Electrification Conference and Expo (ITEC) 2016 : Asia-Pacific, pp.1-5 |
10 |
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Conference
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2016 |
Thermal and Electrical Designs of RF 3D Module Based on Si Interposers with Redundant TSVs
Kwang-Seong Choi
Electronic Components and Technology Conference (ECTC) 2016, pp.2051-2057 |
2 |
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Conference
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2016 |
Dynamic-Interaction UI/UX Design for the AREIS
Hye Sun Park
International Conference on Human-Computer Interaction (HCI International) 2016 (LNCS 9732), v.9732, pp.412-418 |
5 |
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Conference
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2016 |
Population Dynamics Analysis for Policy Evaluation Using Micro-Level Population Dynamics
Karandeep Singh
International Conference on High Performance Computing and Simulation (HPCS) 2016, pp.310-317 |
0 |
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Conference
|
2010 |
2.14/3.5 GHz Novel Dual-band Negative Group Delay Circuit Design based on Composite Right/Left Handed Transmission Line
Heungjae Choi European Microwave Conference (EuMC) 2010, pp.441-444 |
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Conference
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2010 |
21-Channel Surround System based on Physical Reconstruction of a Three Dimensional Target Sound Field
Jeongil Seo
AES Convention 2010, pp.1-11 |
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Conference
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2010 |
3D SiP Module using TSV and Novel Solder Bump Maker
Hyun-Cheol Bae
Electronic Components and Technology Conference (ECTC) 2010, pp.1637-1641 |
5 |
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Conference
|
2010 |
60GHz Metallic-Rectangular-Grooves based Reflectarray Antenna Illuminated by an E-plane Sectoral Horn Feeder
Woo Jin Byun
Antennas and Propagation Society International Symposium (APSURSI) 2010, pp.1-4 |
2 |
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Conference
|
2010 |
Analysis of Power Consumption and Efficient Power Saving Techniques for MIMO-OFDM-Based Wireless LAN Receivers
Il-Gu Lee
International Conference on Sensor Technologies and Applications (SENSORCOMM) 2010, pp.597-601 |
5 |
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