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Conference
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2022 |
Interconnection Reliability of Mini LEDs for Display Applications
In-Seok Kye
Electronic Components and Technology Conference (ECTC) 2022, pp.1184-20 |
0 |
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Conference
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2022 |
Epoxy based Solder Paste for Flexible Substrate with Laser Assisted Bonding Process
Ki-Seok Jang
Electronic System-Integration Technology Conference (ESTC) 2022, pp.28-30 |
2 |
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Conference
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2022 |
Mini LED array transferred onto a flexible substrate using Simultaneous Transfer and Bonding (SITRAB) process and Anisotropic Solder Film (ASF)
Jiho Joo
Electronic Components and Technology Conference (ECTC) 2022, pp.619-624 |
2 |
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Conference
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2022 |
Manufacturing Intelligence Collaboration Framework for Autonomous Manipulation System
Hyonyoung Han
International Conference on Control, Automation and Systems (ICCAS 2022), pp.1930-1933 |
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Conference
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2022 |
Design of the Multibeam Reflector Antenna for GEO flexible Satellite
Sohyeun Yun
Asia-Pacific Conference on Communications (APCC) 2022, pp.182-183 |
1 |
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Conference
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2022 |
Laser-Assisted Bonding (LAB) Process and its Bonding Materials as Technologies enabling the Low-Carbon Era
Kwang-Seong Choi
Electronic Components and Technology Conference (ECTC) 2022, pp.196-203 |
6 |
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Conference
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2022 |
Downlink link-level Simulator designs for 3GPP Rel. 16 NR Non-Terrestrial Networks
Gyeongrae Im
Asia-Pacific Conference on Communications (APCC) 2022, pp.647-648 |
0 |
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Conference
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2021 |
Development of simultaneous transferring and bonding (SITRAB) process for µLED arrays using Anisotropic Solder Paste (ASP) and Laser-Assisted Bonding (LAB) Technology
Jiho Joo
Electronic Components and Technology Conference (ECTC) 2021, pp.687-692 |
5 |
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Conference
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2022 |
Synthesizing a Reference Image from the Macro Images of a Painting for Vignetting Correction
Soonchul Jung
International Conference on Computational Science and Computational Intelligence (CSCI) 2022, pp.1-3 |
0 |
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Conference
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2022 |
Low Height Wire bond Looping Technology Using Wedge Bonding for the MMIC Package
Ah-Young Park Electronic System-Integration Technology Conference (ESTC) 2022, pp.169-174 |
0 |
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