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Type Year Title Cited Download
Conference
2010 SNR-Based Mask Compensation for Computational Auditory Scene Analysis Applied to Speech Recognition in a Car Environment   Ji Hun Park  International Speech Communication Association (INTERSPEECH) 2010, pp.725-728
Conference
2010 Structural Quality of CIGS Absorber Layers Via Powder Evaporation and Solution Spray Deposition   Jeong Dae Suh   Photovoltaic Specialists Conference (PVSC) 2010, pp.2503-2505 0
Conference
2010 Superwideband Extension of G.718 and G.729.1 Speech Codecs   Lasse Laaksonen  International Speech Communication Association (INTERSPEECH) 2010, pp.2382-2385
Conference
2010 Synthesis and Characterizations of Nanocrystalline CIGS Chalcopyrite Powders by Ambient Atmosphere Non Vacuum Process   Jeong Dae Suh   The Electrochemical Society (ECS) Meeting 2010 (218th), pp.1-1
Conference
2010 The Thickness Effect of SiOx Layer in CIGS Thin-Film Solar Cells Fabricated on Stainless-Steel Substrate   Y. D. Chung   Photovoltaic Specialists Conference (PVSC) 2010, pp.3401-3402 3
Conference
2010 Variable block size transforms with higher order kernels for ultra-high definition video coding   Bumshik Lee  IS&T/SPIE Electronic Imaging 2010 (SPIE 7543), pp.1-9 3
Conference
2011 10 Gb/s REAM-SOA for Low Cost WDM-PON   Hyun-Soo Kim   Optical Fiber Communication Conference and Exposition (OFC) 2011 / National Fiber Optic Engineers Conference (NFOEC) 2011, pp.1-3
Conference
2011 3.54GHz 10W Envelope Tracking Amplifier with 43% Efficiency Utilizing the 1.5 Bit-High Efficiency Envelope Amplifier   Joon Hyung Kim   Topical Conference on Power Amplifiers for Wireless and Radio Applications (PAWR) 2011, pp.21-24 10
Conference
2011 3 × 485-Gb/s WDM Transmission over 4800 km of ULAF and 12 × 100-GHz WSSs using CO-OFDM and Single Coherent Detection with 80-GS/s ADCs   Xiang Liu  Optical Fiber Communication Conference and Exposition (OFC) 2011 / National Fiber Optic Engineers Conference (NFOEC) 2011, pp.1-3
Conference
2011 3D IC 집적화를 위한 Low-volume Solder-on-Pad 기술   배호은   한국마이크로전자 및 패키징학회 학술 대회 (추계) 2011, pp.1-1