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Type Year Title Cited Download
Conference
2021 Effect of Sintering Process on the Interfacial Reliability of Micro-nano Bimodal Cu Sintered Joints on Power Electronics Substrate   Kirak Son   International Symposium on Microelectronics and Packaging (ISMP) 2021, pp.1-1
Conference
2022 고전력 전기자동차 파워 모듈용 DBC 기판과 IMS 기판의 방열 특성 비교   정봉민   한국반도체 학술대회 (KCS) 2022, pp.427-427
Conference
2022 A Study on the Interfacial Reliability of Micro-nano Bimodal Cu Sintered Joints on DBC/AMB Substrates for Power Module   Kirak Son   한국반도체 학술대회 (KCS) 2022, pp.369-369
Journal
2022 A Geospatial Platform to Manage Large-Scale Individual Mobility for an Urban Digital Twin Platform   Ahyun Lee   Remote Sensing, v.14, no.3, pp.1-22 61 원문
Conference
2022 Multi-Channel, Low Power Neural Recording IC with Wide Input Range   Yi-Gyeong Kim   한국반도체 학술대회 (KCS) 2022, pp.219-219
Conference
2022 Fabrication and Characteristics of 28 GHz Low Noise Amplifier using a mHEMT Technology   Jong-Min Lee   한국반도체 학술대회 (KCS) 2022, pp.1-1
Journal
2022 AI-based Stroke Prediction System Using Body Motion Biosignals during Walking   Jaehak Yu   Journal of Supercomputing, v.78, no.6, pp.8867-8889 8
Journal
2022 Gating Mechanism in Deep Neural Networks for Resource-Efficient Continual Learning   Hyundong Jin  IEEE Access, v.10, pp.18776-18786 4 원문
Conference
2021 Security Use-cases for Countering Threats of CLA and UAV in 6G   Kijung Bong   International Conference on Intelligent Computing and its Emerging Applications (ICEA) 2021, pp.10-15 0
Journal
2022 Coherent Terahertz Wireless Communication using Dual-parallel MZM-based Silicon Photonic Integrated Circuits   Wonkyoung Lee   Seungjun Han  Optics Express, v.30, no.2, pp.2547-2563 18 원문