ETRI-Knowledge Sharing Plaform

KOREAN
논문 검색
Type SCI
Year ~ Keyword

Search Results

Showing 34581-34590 of 40,541.

Display
논문 검색결과
Type Year Title Cited Download
Journal
2018 Analysis of Welfare Effect for the Broadcasting and Communications Markets in Korea   Sungsoo Han   Far East Journal of Electronics and Communications, v.18, no.4, pp.569-586
Journal
2018 Low-Temperature Solution-Processed Zinc Oxide Field Effect Transistor by Blending Zinc Hydroxide and Zinc Oxide Nanoparticle in Aqueous Solutions   Hyeonwoo Shin  Japanese Journal of Applied Physics, v.57, no.5S, pp.1-5 5
Journal
2018 QoE Enhancement Schemes for Video in Converged OFDMA Wireless Networks and EPONs   Divya Chitimalla  IEEE/OSA Journal of Optical Communications and Networking, v.10, no.3, pp.229-239 11
Journal
2018 Iterative Calibration of a Multiview 3D Display With Linear Extrinsic Crosstalk using Camera Feedback   Joonsoo Kim   Applied Optics, v.57, no.16, pp.4576-4582 4
Journal
2018 Soft Memory Box: A Virtual Shared Memory Framework for Fast Deep Neural Network Training in Distributed High Performance Computing   Shinyoung Ahn   IEEE Access, v.6, pp.26493-26504 16 원문
Journal
2018 Efficiently Answering Reachability Queries for Tree-Structured Data in Repetitive Prime Number Labeling Schemes   Jinhyun Ahn  Applied Sciences, v.8, no.5, pp.1-9 3 원문
Journal
2018 Convolutional Neural Network-based Classification System Design with Compressed Wireless Sensor Network Images   Jungmo Ahn  PLOS ONE, v.13, no.5, pp.1-25 28 원문
Journal
2018 Related Document Extraction based on Topic Modeling using Cloud System   Myeong-Ha Hwang   International Journal of Grid and Distributed Computing, v.11, no.5, pp.91-100 0
Journal
2018 VK-Phantom Male with 583 Structures and Female with 459 Structures, based on the Sectioned Images of a Male and a Female, for Computational Dosimetry   Jin Seo Park  Journal of Radiation Research, v.59, no.3, pp.338-380 13 원문
Conference
1996 Multilevel Interconnection Technology using New Pillar Formation Method and CMP Planarization   Min Park   International Chemical-Mechanical Polish for VLSI/ULSI Multilevel Interconnection Conference (CMP-MIC) 1996, pp.291-298