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Type Year Title Cited Download
Conference
2022 An Experimental Study of Sequential Collaboration for Robot Manipulation Task   Seonghyun Kim   International Conference on Control, Automation and Systems (ICCAS 2022), pp.1-2
Conference
2022 Cable Instance Segmentation with Synthetic Data Generation   Assefa Seyoum Wahd   International Conference on Control, Automation and Systems (ICCAS 2022), pp.1533-1538 1
Conference
2022 Interconnection Reliability of Mini LEDs for Display Applications   In-Seok Kye   Electronic Components and Technology Conference (ECTC) 2022, pp.1184-20 0
Conference
2022 Epoxy based Solder Paste for Flexible Substrate with Laser Assisted Bonding Process   Ki-Seok Jang   Electronic System-Integration Technology Conference (ESTC) 2022, pp.28-30 2
Conference
2022 Mini LED array transferred onto a flexible substrate using Simultaneous Transfer and Bonding (SITRAB) process and Anisotropic Solder Film (ASF)   Jiho Joo   Electronic Components and Technology Conference (ECTC) 2022, pp.619-624 2
Conference
2022 Manufacturing Intelligence Collaboration Framework for Autonomous Manipulation System   Hyonyoung Han   International Conference on Control, Automation and Systems (ICCAS 2022), pp.1930-1933
Conference
2022 Design of the Multibeam Reflector Antenna for GEO flexible Satellite   Sohyeun Yun   Asia-Pacific Conference on Communications (APCC) 2022, pp.182-183 1
Conference
2022 Laser-Assisted Bonding (LAB) Process and its Bonding Materials as Technologies enabling the Low-Carbon Era   Kwang-Seong Choi   Electronic Components and Technology Conference (ECTC) 2022, pp.196-203 7
Conference
2022 Downlink link-level Simulator designs for 3GPP Rel. 16 NR Non-Terrestrial Networks   Gyeongrae Im   Asia-Pacific Conference on Communications (APCC) 2022, pp.647-648 0
Conference
2021 Development of simultaneous transferring and bonding (SITRAB) process for µLED arrays using Anisotropic Solder Paste (ASP) and Laser-Assisted Bonding (LAB) Technology   Jiho Joo   Electronic Components and Technology Conference (ECTC) 2021, pp.687-692 5