Subjects :
heterogeneous integration
논문 검색결과
| Type |
Year |
Title |
Cited |
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Conference
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2025 |
Heterogeneous Integration through 2.5D Silicon Interposers for Next-Generation AI and HPC Applications
김덕기 International Symposium on Microelectronics and Packaging (ISMP) 2025, pp.1-1 |
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Conference
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2024 |
Silicon interposer vs. liquid crystal polymer interposer for heterogeneous integration of 0.8Tbps SiPh optical chiplet
Lee Jyung Chan 한국광학회 학술 발표회 (동계) 2024, pp.1-1 |
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Conference
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2023 |
2.5D Large-Scale Interposer Bonding Process Verification using Daisy-Chain for PIM Heterogeneous Integration Platform
Sujin Park International Conference on Electronics, Information and Communication (ICEIC) 2023, pp.1-3 |
0 |
원문
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Conference
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2023 |
Chiplet Heterogeneous-Integration AI Processor
Kwon Young-Su International Conference on Electronics, Information and Communication (ICEIC) 2023, pp.1-2 |
11 |
원문
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Conference
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2019 |
Heterogeneous Integration of III-V Photonic Devices with Silicon: From Laser Diodes to Single Photon Emitters
Young-Ho Ko 한국물리학회 학술 논문 발표회 (가을) 2019, pp.1-1 |
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Journal
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2017 |
Hidden Innovations in the Fourth Industrial Revolution: Electronic Packaging Technology
Choi Kwang-Seong 전자통신동향분석, v.32, no.6, pp.17-26 |
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원문
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Journal
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2017 |
Technical Trend of Fusion Semiconductor Devices Composed of Silicon and Compound Materials
Lee Sang-Heung 전자통신동향분석, v.32, no.6, pp.8-16 |
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원문
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특허 검색결과
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Family Pat. |
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연구보고서 검색결과
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