Subjects :
Shear strength
논문 검색결과
| Type |
Year |
Title |
Cited |
Download |
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Journal
|
2025 |
Reliability Enhancement of 30 μm-Pitch Interconnections via Room-Temperature Laser-Assisted Bonding with Compression (LABC) Using Optimized Laser Non-Conductive Paste (LNCP)
Lee Gaeun Journal of Korean Institute of Metals and Materials, v.63, no.8, pp.583-593 |
0 |
원문
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Conference
|
2024 |
Development of a Full-Color MicroLED Display Utilizing Novel Simultaneous Transfer and Bonding (SITRAB) Process and SITRAB Film Technology
Jiho Joo Society for Information Display (SID) International Symposium 2024, pp.1309-1312 |
0 |
원문
|
|
Conference
|
2023 |
Development of a highly reliable Mini-LED display module using simultaneous transfer and bonding (SITRAB) technology
Jiho Joo Society for Information Display (SID) International Symposium 2023, pp.433-436 |
3 |
원문
|
|
Journal
|
2023 |
Thermally stable and soft pressure-sensitive adhesive for foldable electronics
조우성 Chemical Engineering Journal, v.452, no.1, pp.1-8 |
23 |
원문
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|
Journal
|
2023 |
Thermally stable and soft pressure-sensitive adhesive for foldable electronics
정기훈 Chemical Engineering Journal, v.452, no.1, pp.1-8 |
23 |
원문
|
|
Conference
|
2022 |
Interconnection Reliability of Mini LEDs for Display Applications
Kye Inseok Electronic Components and Technology Conference (ECTC) 2022, pp.1184-20 |
0 |
원문
|
|
Journal
|
2016 |
Thermoelectric Cooler Module with Enhanced Cooling Ability Using a Hybrid Cu Paste and a Si Substrate
Bae Hyun-Cheol Journal of Nanoscience and Nanotechnology, v.16, no.12, pp.12732-12736 |
2 |
원문
|
|
Conference
|
2014 |
Shear Strength Analysis of Hybrid Cu Paste for Thermoelectric Device Module
Ae Sun Oh 한국마이크로전자 및 패키징학회 학술 대회 2014, pp.1-1 |
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Journal
|
2008 |
Electrical and Mechanical Characterization of an Anisotropic Conductive Adhesive with a Low Melting Point Solder
Eom Yong Sung Microelectronic Engineering, v.85, no.11, pp.2202-2206 |
32 |
원문
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특허 검색결과
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Family Pat. |
KIPRIS |
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연구보고서 검색결과
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