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Conference
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2023 |
Process Window of Mini-LED Display Panel Packaging using Laser Assisted Bonding Technology
Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2023, pp.1-4 |
1 |
원문
|
|
Journal
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2020 |
Effects of Graphene Oxide-Gold Nanoparticles Nanocomposite on Highly Sensitive Foot-and-Mouth Disease Virus Detection
Jong-Won Kim Nanomaterials, v.10, no.10, pp.1-11 |
34 |
원문
|
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Journal
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2019 |
Conductive adhesive with transient liquid‐phase sintering technology for high‐power device applications
Eom Yong Sung ETRI Journal, v.41, no.6, pp.820-828 |
11 |
원문
|
|
Journal
|
2017 |
Development of In–Bi–Sn Composite Metal Inks with Modified Properties for 3D Printed Electronics
Bonjin Koo Journal of Nanoscience and Nanotechnology, v.17, no.10, pp.7529-7534 |
2 |
원문
|
|
Conference
|
2017 |
Low-temperature Sintering Behavior of Ternary Solder and Copper Powder for High-Power Device Packaging
Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2017, pp.1-4 |
0 |
원문
|
|
Journal
|
2016 |
Curing Kinetics and Chemorheological Behavior of No-flow Underfill for Sn/In/Bi Solder in Flexible Packaging Applications
Eom Yong Sung ETRI Journal, v.38, no.6, pp.1179-1189 |
5 |
원문
|
|
Conference
|
2015 |
Characterization of Hybrid Underfill for Low-Temperature Process Applicable to Flexible Substrate
Jihye Son Electronics Packaging Technology Conference (EPTC) 2015, pp.1-4 |
0 |
원문
|
|
Conference
|
2014 |
Flip-Chip Bonding Processes with Low Volume SoP Technology
Eom Yong Sung Electronic System-Integration Technology Conference (ESTC) 2014, pp.1-4 |
0 |
원문
|
|
Journal
|
2013 |
Optimization of Material and Process for Fine Pitch LVSoP Technology
Eom Yong Sung ETRI Journal, v.35, no.4, pp.625-631 |
21 |
원문
|
|
Journal
|
2012 |
Sn-Based Chalcogenide Composite as a High-Capacity Anode Material for Lithium Rechargeable Batteries
이용민 Journal of the American Ceramic Society, v.95, no.7, pp.2272-2276 |
8 |
원문
|
|
Journal
|
2010 |
Chemo-Rheological Characteristics of a Self-Assembling Anisotropic Conductive Adhesive System Containing a Low-Melting Point Solder
백지원 Microelectronic Engineering, v.87, no.10, pp.1968-1972 |
32 |
원문
|
|
Journal
|
2010 |
Electrical Interconnection with a Smart ACA Composed of Fluxing Polymer and Solder Powder
Eom Yong Sung ETRI Journal, v.32, no.3, pp.414-421 |
52 |
원문
|
|
Journal
|
2008 |
Characterization of Polymer Matrix and Low Melting Point Solder for Anisotropic Conductive Film
Eom Yong Sung Microelectronic Engineering, v.85, no.2, pp.327-331 |
64 |
원문
|
|
Journal
|
2006 |
Sb-Se-Based Phase-Change Memory Device With Lower Power and Higher Speed Operations
Yoon Sung Min IEEE Electron Device Letters, v.27, no.6, pp.445-447 |
113 |
원문
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