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Conference
|
2021 |
Simultaneous Transfer and Bonding (SITRAB) Process for Micro-LEDs Using Laser-Assisted Bonding with Compression (LABC) Process and SITRAB Adhesive
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2021, pp.1607-1613 |
16 |
원문
|
|
Journal
|
2017 |
3D Printing Based Single-Build Process for Electronic Devices
Dang Hyun Woo Journal of Nanoscience and Nanotechnology, v.17, no.10, pp.7259-7263 |
0 |
원문
|
|
Journal
|
2010 |
High-Density Nano-Scale N-Channel Trench-Gated MOSFETs Using the Self-Aligned Technique
Kim Sang Gi Journal of the Korean Physical Society, v.57, no.4, pp.802-805 |
3 |
원문
|
|
Conference
|
2007 |
Novel Process for the Electrodes of Microbolometer
Ryu Hojun International Conference on Sensor Technologies and Applications (SENSORCOMM) 2007, pp.10-13 |
1 |
원문
|
|
Journal
|
2004 |
High-density Trench Gate DMOSFETs with Trench Contact Structure
Kim Jongdae Electronics Letters, v.40, no.11, pp.699-700 |
5 |
원문
|
|
Journal
|
2002 |
A Novel Process for Fabricating a High Density Trench MOSFETs for DC-DC Converters
Kim Jongdae ETRI Journal, v.24, no.5, pp.333-340 |
24 |
원문
|