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Journal
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2021 |
Fabrication of Cu Wiring Touch Sensor via Laser Sintering of Cu Nano/Microparticle Paste on 3D‐Printed Substrate
Ahn Hyeon-Sik Advanced Engineering Materials, v.23, no.1, pp.1-9 |
6 |
원문
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Journal
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2016 |
Thermoelectric Cooler Module with Enhanced Cooling Ability Using a Hybrid Cu Paste and a Si Substrate
Bae Hyun-Cheol Journal of Nanoscience and Nanotechnology, v.16, no.12, pp.12732-12736 |
2 |
원문
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Conference
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2015 |
High Performance Thermoelectric Cooler Module Using Hybrid Cu Paste and Si Substrate
Bae Hyun-Cheol International Conference on Advanced Electromaterials (ICAE) 2015, pp.1-1 |
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Conference
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2015 |
Cost-Effective Thermoelectric Cooler Packaging Using Hybrid Cu Paste
Bae Hyun-Cheol European Microelectronics and Packaging Conference (EMPC) 2015, pp.1-4 |
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Conference
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2015 |
Isotropic Conductive Paste Based on Epoxy with Ag Coated Cu and SAC305 Solder
Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2015, pp.1-5 |
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