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Conference
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2019 |
Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration
Choi Kwang-Seong International 3D Systems Integration Conference (3DIC) 2019, pp.1-3 |
3 |
원문
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Conference
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2014 |
Fault Detection and Isolation of Multiple Defects in Through Silicon Via (TSV) Channel
정현석 International 3D Systems Integration Conference (3DIC) 2014, pp.1-5 |
5 |
원문
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Conference
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2013 |
Si-interposer Design for GPU-Memory Integration concerning the Signal Integrity
조종현 DesignCon 2013, pp.1-20 |
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Journal
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2012 |
Novel Bumping and Underfill Technologies for 3D IC integration
성기준 ETRI Journal, v.34, no.5, pp.706-712 |
31 |
원문
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Conference
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2012 |
Novel Low-Volume Solder-on-Pad (SoP) Material and Process for Flip Chip Bonding Using Au Stud Bumps
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2012, pp.1919-1924 |
1 |
원문
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Journal
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2012 |
Technical Trends of Interposers for 2.5D Integration
Choi Kwang-Seong 전자통신동향분석, v.27, no.1, pp.51-60 |
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원문
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Conference
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2011 |
Low-volume Solder-on-Pad Technology for 3D IC Integration
Ho-Eun Bae 한국마이크로전자 및 패키징학회 학술 대회 (추계) 2011, pp.1-1 |
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Conference
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2011 |
Bumping and Stacking Processes for 3D IC using Fluxfree Polymer
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2011, pp.1746-1751 |
3 |
원문
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Journal
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2010 |
3D IC Using through Silicon via Technologies
Choi Kwang-Seong 전자통신동향분석, v.25, no.5, pp.97-105 |
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원문
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