Subjects :
Electronic Packaging
논문 검색결과
| Type |
Year |
Title |
Cited |
Download |
|
Journal
|
2021 |
Fabrication of Cu Wiring Touch Sensor via Laser Sintering of Cu Nano/Microparticle Paste on 3D‐Printed Substrate
Ahn Hyeon-Sik Advanced Engineering Materials, v.23, no.1, pp.1-9 |
6 |
원문
|
|
Journal
|
2017 |
Hidden Innovations in the Fourth Industrial Revolution: Electronic Packaging Technology
Choi Kwang-Seong 전자통신동향분석, v.32, no.6, pp.17-26 |
|
원문
|
|
Journal
|
2016 |
Development of the Structure for Enhancing Capillary Force of the Thin Flat Heat Pipe Based on Extrusion Fabrication
Moon Seok-Hwan 대한기계학회논문집 B, v.40, no.11, pp.755-759 |
0 |
원문
|
|
Conference
|
2015 |
Development of the Structure for Enhancing Capillary Force of the Thin Flat Heat Pipe
Moon Seok-Hwan 대한기계학회 창립 70주년 기념 학술 대회 2015, pp.978-981 |
|
|
|
Journal
|
2011 |
Development of a Flat-Plate Cooling Device for Electronic Packaging
Moon Seok-Hwan ETRI Journal, v.33, no.4, pp.645-647 |
6 |
원문
|
특허 검색결과
| Status |
Year |
Patent Name |
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Family Pat. |
KIPRIS |
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연구보고서 검색결과
| Type |
Year |
Research Project |
Primary Investigator |
Download |
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