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Conference
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2025 |
Enhancement of High-speed Characteristics of EML Submodule Utilizing LC Resonance Effect with Capacitive Wire-Bonding Pad
Yun Seok Jun Optics and Photonics Congress 2025, pp.1-1 |
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|
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Conference
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2025 |
Enhancement of RF Performance of 128-Gbaud Lumped EML Submodule Utilizing LC Resonance with Capacitive Wire-Bonding Pad
Yun Seok Jun Optical Fiber Communication Conference (OFC) 2025, pp.1-3 |
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|
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Journal
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2024 |
Four-channel GaAs multifunction chips with bottom RF interface for Ka-band SATCOM antennas
Jeong Jin Cheol ETRI Journal, v.46, no.2, pp.323-332 |
3 |
원문
|
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Conference
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2022 |
Low Height Wire bond Looping Technology Using Wedge Bonding for the MMIC Package
박아영 Electronic System-Integration Technology Conference (ESTC) 2022, pp.169-174 |
0 |
원문
|
|
Journal
|
2022 |
Controlled-NOT operation of SiN-photonic circuit using photon pairs from silicon-photonic circuit
Lee Jong-Moo Optics Communications, v.509, pp.1-5 |
16 |
원문
|
|
Conference
|
2021 |
Thermal and Electrical Reliability Analysis of TO-247 for Bonding Method, Substrate Structure and Heat Dissipation Bonding Material
Donghwan Kim Electronic Components and Technology Conference (ECTC) 2021, pp.1950-1956 |
5 |
원문
|
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Conference
|
2021 |
Analysis of Parasitic Effects by Bonding Structure
Hyun-Gyu Jang International Conference on Electronics, Information and Communication (ICEIC) 2021, pp.434-435 |
0 |
원문
|
|
Conference
|
2017 |
Al wire bonding process of Power Semiconductor packaging process
Oh Ae Sun 대한전자공학회 종합 학술 대회 (하계) 2017, pp.229-231 |
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|
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Conference
|
2007 |
Fabrication of a Direct-Type Silicon Pixel Detector for a Large Area Hybrid X-Ray Imaging Device
Park Kun Sik Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC) 2007, pp.3446-3449 |
1 |
원문
|
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Journal
|
2007 |
A Flip-Chip-Packaged InP HBT Transimpedance Amplifier for 40-Gb/s Optical Link Applications
Ju Chull Won Journal of the Korean Physical Society, v.50, no.3, pp.862-865 |
2 |
원문
|
|
Conference
|
2006 |
Low Noise and Power Amplifier Modules for 60 GHz Wireless Personal Area Network Applications
Mun Jae Kyoung 한국통신학회 종합 학술 발표회 (하계) 2006, pp.861-863 |
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|
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Conference
|
2006 |
Low Noise Amplifier Module for 60 GHz Wireless Personal Area Network (WPAN) utilizing Multilayer Low Temperature Co-fired Ceramic Technology
Mun Jae Kyoung ESA Workshop on Millimetre Wave Technology and Applications 2006, pp.1-4 |
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|
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Conference
|
2003 |
A limiting amplifier module using wafer level package for 10Gbps optical transmission system
Ju Chull Won Electronic Components and Technology Conference (ECTC) 2003, pp.1572-1575 |
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원문
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