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Journal
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2025 |
Structural Evolution and Cu Diffusion Mechanism in Bi2Se3 Thin Films on YBa2Cu3O7 as a Function of Cracked-Se Processing Time
Lee Woo Jung Crystal Growth & Design, v.25, no.5, pp.1439-1447 |
1 |
원문
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Conference
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2022 |
Laser-Assisted Bonding (LAB) Process and its Bonding Materials as Technologies enabling the Low-Carbon Era
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2022, pp.196-203 |
7 |
원문
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Conference
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2021 |
Health Management Technology for Estimating the Remaining Useful Life of Household Appliances
Kim Nack Woo International Conference on Consumer Electronics (ICCE) 2021 : Asia, pp.1-3 |
2 |
원문
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Journal
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2021 |
Evolution of Morphological and Chemical Properties at p–n Junction of Cu(In,Ga)Se2 Solar Cells with Zn(O,S) Buffer Layer as a Function of KF Postdeposition Treatment Time
Lee Woo Jung ACS Applied Materials & Interfaces, v.13, no.41, pp.48611-48621 |
11 |
원문
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Conference
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2021 |
Simultaneous Transfer and Bonding (SITRAB) Process for Micro-LEDs Using Laser-Assisted Bonding with Compression (LABC) Process and SITRAB Adhesive
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2021, pp.1607-1613 |
16 |
원문
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Conference
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2021 |
59‐5: Simultaneous Transfer and Bonding (SITRAB) Process for Mini‐LED Display
Choi Kwang-Seong Society for Information Display (SID) International Symposium 2021, pp.841-844 |
5 |
원문
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Conference
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2015 |
A Cloud Transcoder Using Download Cache Scheme
Kwon Eun Jung International Conference on Information and Communication Technology Convergence (ICTC) 2015, pp.801-803 |
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Conference
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2010 |
Solder Bump Maker with Coining Process on TSV Chips for 3D Packages
성기준 International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP) 2010, pp.185-189 |
4 |
원문
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Journal
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2007 |
Simple Ring-type Passive Optical Network with Two-fiber Protection Scheme and Performance Analysis
Lee Byung-Tak Optical Engineering, v.46, no.6, pp.1-6 |
11 |
원문
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