|
Conference
|
2015 |
A Basic Study of Activity Type Detection and Energy Expenditure Estimation for Children and Youth in Daily Life Using 3-axis Accelerometer and 3-Stage Cascaded Artificial Neural Network
Yongwon Jang
International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC) 2015, pp.2860-2863 |
4 |
|
|
Conference
|
2015 |
Design of GNSS Jamming Propagation Simulator using ITU-R P.1546 Propagation Model
Inone Joo
International Conference on Control, Automation and Systems (ICCAS) 2015, pp.1359-1362 |
8 |
|
|
Conference
|
2015 |
Adaptive Code Decision Algorithm for Real-Time Software Signal Generator
Tae-Hee Kim
International Conference on Control, Automation and Systems (ICCAS) 2015, pp.1384-1388 |
0 |
|
|
Conference
|
2015 |
Estimating the Number of Clusters with Database for Texture Segmentation Using Gabor Filter
Minkyu Kim
International Conference on Computer Vision Systems (ICVS) 2015 (LNCS 9163), pp.435-44 |
3 |
|
|
Conference
|
2015 |
Fast Magnetic Field Simulation with Linear System Approach
Jaeho Lim
International Conference on Control, Automation and Systems (ICCAS) 2015, pp.1425-1428 |
|
|
|
Conference
|
2015 |
Multi-Electrode Arrays Modified with Bimetallic Nanoparticles; Electrical Performance and Neural Signal Recording
Yong Hee Kim
International Conference on Nanotechnology (IEEE-NANO) 2015, pp.238-241 |
1 |
|
|
Conference
|
2015 |
Novel Measurement of Blood Velocity Profile Using Translating-Stage Optical Method and Theoretical Modeling Based on Non-Newtonian Viscosity Model
Chang-Beom Kim
International Conference on Nano-Bio Sensing, Imaging, and Spectroscopy (NBSIS) 2015 (SPIE 9523), pp.1-7 |
0 |
|
|
Conference
|
2015 |
A Novel Packaging Method of Fully Passive Optical Alignment for Multi-Chennel Optical Interconnection Module
Kwon-Seob Lim
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) 2015, pp.156-158 |
0 |
|
|
Conference
|
2015 |
UnAMT
Jaehwan Kim
ACM SIGGRAPH Asia 2015, pp.1-1 |
0 |
|
|
Conference
|
2015 |
Characterization of Hybrid Underfill for Low-Temperature Process Applicable to Flexible Substrate
Jihye Son
Electronics Packaging Technology Conference (EPTC) 2015, pp.1-4 |
0 |
|