Subjects :
conductive adhesive
논문 검색결과
| Type |
Year |
Title |
Cited |
Download |
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Journal
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2019 |
Conductive adhesive with transient liquid‐phase sintering technology for high‐power device applications
Eom Yong Sung ETRI Journal, v.41, no.6, pp.820-828 |
10 |
원문
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Conference
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2014 |
Maskless Screen Printing Technology for 20μm-Pitch, 52InSn Solder Interconnections in Display Applications
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2014, pp.1154-1159 |
8 |
원문
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Conference
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2013 |
Epoxy Copper Paste as an Isotropic Conductive Adhesive
Eom Yong Sung International Conference on Electronics Packaging (ICEP) 2013, pp.507-510 |
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Journal
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2010 |
Chemo-Rheological Characteristics of a Self-Assembling Anisotropic Conductive Adhesive System Containing a Low-Melting Point Solder
백지원 Microelectronic Engineering, v.87, no.10, pp.1968-1972 |
32 |
원문
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Journal
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2010 |
Electrical Interconnection with a Smart ACA Composed of Fluxing Polymer and Solder Powder
Eom Yong Sung ETRI Journal, v.32, no.3, pp.414-421 |
52 |
원문
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|
Journal
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2009 |
Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive)
임병승 Materials Transactions, v.50, no.7, pp.1684-1689 |
7 |
원문
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Journal
|
2008 |
Electrical and Mechanical Characterization of an Anisotropic Conductive Adhesive with a Low Melting Point Solder
Eom Yong Sung Microelectronic Engineering, v.85, no.11, pp.2202-2206 |
32 |
원문
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|
Journal
|
2007 |
Electric-Circuit-Embedded Polymer Optical Bench
Jin Tae Kim IEEE Photonics Technology Letters, v.19, no.5, pp.318-320 |
1 |
원문
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Journal
|
2007 |
O/E Integration of Polymer Waveguide Devices by Using Replication Technology
Jin Tae Kim IEEE Journal of Selected Topics in Quantum Electronics, v.13, no.2, pp.177-184 |
10 |
원문
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연구보고서 검색결과
| Type |
Year |
Research Project |
Primary Investigator |
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