Subjects : Polymer resin
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Journal | 2013 | Fine‐Pitch Solder on Pad Process for Microbump Interconnection Bae Hyun-Cheol ETRI Journal, v.35, no.6, pp.1152-1155 | 25 | 원문 |
| Journal | 2012 | Graphene-Based Polymer Waveguide Polarizer Kim Jin Tae Optics Express, v.20, no.4, pp.3556-3652 | 137 | 원문 |
| Conference | 2010 | 3D SiP Module using TSV and Novel Solder Bump Maker Bae Hyun-Cheol Electronic Components and Technology Conference (ECTC) 2010, pp.1637-1641 | 5 | 원문 |
| Conference | 2006 | Application of UV Nanoimprint Lithography in Polymer Photonic Nano-Systems Choi Choon Gi Nanotechnology Materials and Devices Conference (NMDC) 2006, pp.1-2 | ||
| Journal | 2005 | Thermal Characteristics of a Laser Diode Integrated on a Silica-Terraced PLC Platform Kim Duk Jun ETRI Journal, v.27, no.3, pp.337-340 | 7 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
|---|---|---|---|---|---|
| Registered | 2013 | METHOD OF FORMING SOLDER ON PAD ON FINE PITCH PCB AND METHOD OF FLIP CHIP BONDING SEMICONDUCTOR USING THE SAME | UNITED STATES | ||
| Registered | 2009 | METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING THE SAME | UNITED STATES | ||
| Registered | 2013 | COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING THE SAME | UNITED STATES | ||
| Registered | 2014 | COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING THE SAME | UNITED STATES | ||
| Registered | 2014 | COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING THE SAME | UNITED STATES | ||
| Registered | 2009 | COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING THE SAME | UNITED STATES |
| Type | Year | Research Project | Primary Investigator | Download |
|---|---|---|---|---|
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