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Journal
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2019 |
Conductive adhesive with transient liquid‐phase sintering technology for high‐power device applications
Eom Yong Sung ETRI Journal, v.41, no.6, pp.820-828 |
10 |
원문
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Journal
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2017 |
Development of In–Bi–Sn Composite Metal Inks with Modified Properties for 3D Printed Electronics
Bonjin Koo Journal of Nanoscience and Nanotechnology, v.17, no.10, pp.7529-7534 |
2 |
원문
|
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Conference
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2014 |
Development of Low Contact Resistance Interconnection for Display Applications
Haksun Lee Electronic System-Integration Technology Conference (ESTC) 2014, pp.1-5 |
4 |
원문
|
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Journal
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2012 |
Sn-Based Chalcogenide Composite as a High-Capacity Anode Material for Lithium Rechargeable Batteries
이용민 Journal of the American Ceramic Society, v.95, no.7, pp.2272-2276 |
8 |
원문
|
|
Conference
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2011 |
Bumping and Stacking Processes for 3D IC using Fluxfree Polymer
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2011, pp.1746-1751 |
3 |
원문
|
|
Journal
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2010 |
Chemo-Rheological Characteristics of a Self-Assembling Anisotropic Conductive Adhesive System Containing a Low-Melting Point Solder
백지원 Microelectronic Engineering, v.87, no.10, pp.1968-1972 |
32 |
원문
|
|
Journal
|
2010 |
Novel Maskless Bumping for 3D Integration
Choi Kwang-Seong ETRI Journal, v.32, no.2, pp.342-344 |
37 |
원문
|
|
Journal
|
2009 |
Catalytic Behavior of Sn/Bi Metal Powder in Anhydride-Based Epoxy Curing
Keonsoo Jang Journal of Nanoscience and Nanotechnology, v.9, no.12, pp.7461-7466 |
31 |
원문
|
|
Journal
|
2009 |
Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive)
임병승 Materials Transactions, v.50, no.7, pp.1684-1689 |
7 |
원문
|
|
Journal
|
2008 |
Electrical and Mechanical Characterization of an Anisotropic Conductive Adhesive with a Low Melting Point Solder
Eom Yong Sung Microelectronic Engineering, v.85, no.11, pp.2202-2206 |
32 |
원문
|
|
Journal
|
2008 |
Characterization of Polymer Matrix and Low Melting Point Solder for Anisotropic Conductive Film
Eom Yong Sung Microelectronic Engineering, v.85, no.2, pp.327-331 |
64 |
원문
|
|
Journal
|
2006 |
Sb-Se-Based Phase-Change Memory Device With Lower Power and Higher Speed Operations
Yoon Sung Min IEEE Electron Device Letters, v.27, no.6, pp.445-447 |
112 |
원문
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