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Conference
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2024 |
A Ka-band 4-Channel Beamforming Transceiver IC for Inter-Satellite Communication Systems
Yoo Jongho International Conference on Information and Communication Technology Convergence (ICTC) 2024, pp.1784-1786 |
1 |
원문
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Conference
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2023 |
94GHz Fan-Out Wafer-Level Packaging (FOWLP) for High-Resolution Proximity Sensors, Autonomous Driving, and 5G/6G Telecommunication Systems
Jiho Joo International Symposium on Microelectronics and Packaging (ISMP) 2023, pp.1-23 |
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Conference
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2023 |
Laser-Assisted Bonding with Compression (LABC) based Tiling Bonding Technology, Enabling Technology for Chiplet Integration
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2023, pp.1385-1389 |
5 |
원문
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Journal
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2019 |
Wafer-Level-Based Open-Circuit Sensitivity Model from Theoretical ALEM and Empirical OSCM Parameters for a Capacitive MEMS Acoustic Sensor
Jaewoo Lee Sensors, v.19, no.3, pp.1-14 |
2 |
원문
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Conference
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2018 |
Equivalent Circuit-based Open-circuit Sensitivity Modelling of a Capacitive-type MEMS Acoustic Sensor on Wafer Level
Jaewoo Lee Eurosensors 2018, pp.1-4 |
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Journal
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2015 |
Microdevice for Separation of Circulating Tumor Cells Using Embedded Magnetophoresis with V-shaped Ni-Co Nanowires and Immuno-nanomagnetic Beads
Park Jeong Won ETRI Journal, v.37, no.2, pp.233-240 |
19 |
원문
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Conference
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2011 |
Cost-Effective and High-Performance FBAR Duplexer Module with Wafer Level Packaging
Bae Hyun-Cheol Asia-Pacific Microwave Conference (APMC) 2011, pp.1074-1077 |
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Journal
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2007 |
A Flip-Chip-Packaged InP HBT Transimpedance Amplifier for 40-Gb/s Optical Link Applications
Ju Chull Won Journal of the Korean Physical Society, v.50, no.3, pp.862-865 |
2 |
원문
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Conference
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2003 |
A limiting amplifier module using wafer level package for 10Gbps optical transmission system
Ju Chull Won Electronic Components and Technology Conference (ECTC) 2003, pp.1572-1575 |
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원문
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Conference
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2002 |
The effect of via size on fine pitch and high density solder bumps for wafer level packaging
Ju Chull Won Electronic Components and Technology Conference (ECTC) 2002, pp.1178-1181 |
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원문
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