Subjects :
Processing temperature
논문 검색결과
| Type |
Year |
Title |
Cited |
Download |
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Journal
|
2024 |
Wide process temperature of atomic layer deposition for In2 O3 thin-film transistors using novel indium precursor (N,N′-di-tert butylacetimidamido)dimethyllindium
Juhun Lee Nanotechnology, v.35, no.37, pp.1-9 |
1 |
원문
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|
Journal
|
2018 |
원자층 증착법을 이용한 고이동도 초박막 결정질 인듐 옥사이드 박막 트랜지스터
Lee Jongchan Applied Physics Letters, v.113, no.11, pp.1-5 |
61 |
원문
|
|
Conference
|
2017 |
Low-temperature Sintering Behavior of Ternary Solder and Copper Powder for High-Power Device Packaging
Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2017, pp.1-4 |
0 |
원문
|
|
Journal
|
2016 |
Curing Kinetics and Chemorheological Behavior of No-flow Underfill for Sn/In/Bi Solder in Flexible Packaging Applications
Eom Yong Sung ETRI Journal, v.38, no.6, pp.1179-1189 |
5 |
원문
|
|
Journal
|
2012 |
Effects of the Surface Wettability of a Polymeric Insulator in a Solution-Processed Organic Transistor
김동욱 Molecular Crystals and Liquid Crystals, v.567, no.1, pp.50-56 |
0 |
원문
|
|
Journal
|
2011 |
Water-Related Abnormal Instability of Transparent Oxide/Organic Hybrid Thin Film Transistors
Yang Shinhyuk Applied Physics Letters, v.98, no.10, pp.1-3 |
31 |
원문
|
|
Conference
|
2006 |
Characterization of Nafion Solid Polymer Elecrolyte for an Electrochemical Sensor using Scnanning Probe Microscopy and Electrochemical Impedance Spectroscopy
Park Jonghyurk IEEE Sensors 2006, pp.1261-1264 |
1 |
원문
|
특허 검색결과
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