Subjects :
temperature difference
논문 검색결과
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Conference
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2021 |
Analysis of Temperature Characteristics of Gate Channels by DC Bias Conditions for Large-Size GaN FET Modeling
Woojin Chang International Conference on Consumer Electronics (ICCE) 2021 : Asia, pp.398-392 |
1 |
원문
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Conference
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2021 |
Analysis of Temperature Characteristics of Gate Channel by DC Bias Conditions for GaN Large-Sized HEMT Modeling
Woojin Chang 대한전자공학회 학술 대회 (하계) 2021, pp.315-319 |
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Conference
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2021 |
Thermal and Electrical Reliability Analysis of TO-247 for Bonding Method, Substrate Structure and Heat Dissipation Bonding Material
Donghwan Kim Electronic Components and Technology Conference (ECTC) 2021, pp.1950-1956 |
5 |
원문
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Journal
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2021 |
Thermal analysis of 22.9-kV crosslinked polyethylene cable joint based on partial discharge using fiber Bragg grating sensors
Hyunjin Kim Optical Engineering, v.60, no.3, pp.1-8 |
11 |
원문
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Journal
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2017 |
The Carbon Wire Bundle’s Constructing as a Capillary Wick in the Flat Thin Heat Pipe
Moon Seok-Hwan Applied Thermal Engineering, v.126, pp.1177-1184 |
13 |
원문
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Journal
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2013 |
Effect of Silicide/Silicon Hetero-Junction Structure on Thermal Conductivity and Seebeck Coefficient
Choi Won Chul Journal of Nanoscience and Nanotechnology, v.13, no.12, pp.7801-7805 |
6 |
원문
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Conference
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2011 |
Thermoelectric Properties of the Multilayered Bi2Te3 with Chalcogenide Materials
Ryu Hojun European Conference on Thermoelectrics (ECT) 2011, pp.99-102 |
0 |
원문
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Conference
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2011 |
Fast Pcr Utilizing Buoyant Convection in a Disposable Chip
Chung Kwang Hyo International Conference on Micro Electro Mechanical Systems (MEMS) 2011, pp.865-868 |
3 |
원문
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Journal
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2010 |
A Palmtop PCR System with a Disposable Polymer Chip Operated by the Thermosiphon Effect
Chung Kwang Hyo Lab on a Chip, v.10, no.2, pp.202-210 |
48 |
원문
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Journal
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2009 |
Uncooled Amorphous Silicon 16×16 Infrared Focal Plane Arrays Development
Cheon Sang Hoon 센서학회지, v.18, no.4, pp.301-306 |
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원문
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연구보고서 검색결과
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