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Conference
|
2020 |
Development of bonding process for flexible devices with fine-pitch interconnection using Anisotropic Solder Paste and Laser-Assisted Bonding Technology
Jiho Joo Electronic Components and Technology Conference (ECTC) 2020, pp.1309-1314 |
13 |
원문
|
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Journal
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2020 |
Application of Aluminum Flat Heat Pipe for Dry Cooling near the Hot Spot of a Radar Array with a Multiscale Structure
Moon Seok-Hwan Applied Thermal Engineering, v.169, pp.1-9 |
21 |
원문
|
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Conference
|
2018 |
A Solution of Aluminum Flat Heat Pipe for Dry Cooling the Ladar Array
Suhyun Hong International Heat Transfer Conference (IHTC) 2018, pp.1-8 |
0 |
원문
|
|
Conference
|
2015 |
Development of a Cooling Technology for the Concentrating Solar Module with a Light Guide
Park Yoon Woo 대한설비공학회 학술 발표 대회 (하계) 2015, pp.882-885 |
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|
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Conference
|
2014 |
Development of a Heat Pipe Heat Dissipation Method for CPV Application
Moon Seok-Hwan International Conference on Concentrator Photovoltaic Systems (CPV) 2014, pp.140-143 |
4 |
원문
|
|
Conference
|
2010 |
Development of the Temperature Uniformity Device
Moon Seok-Hwan 대한설비공학회 학술 발표 대회 (동계) 2010, pp.334-339 |
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|
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Journal
|
2002 |
Improving Thermal Performance of Miniature Heat Pipe for Notebook PC Cooling
Moon Seok-Hwan Microelectronics Reliability, v.42, no.1, pp.135-140 |
71 |
원문
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