|
Conference
|
2025 |
Reliability Analysis of Fine-Pitch Interconnections Using Epoxy-Based Laser Bonding Materials with Different Glass Transition Temperatures
Lee Gaeun International Symposium on Microelectronics and Packaging (ISMP) 2025, pp.1-1 |
|
|
|
Conference
|
2023 |
Process Window of Mini-LED Display Panel Packaging using Laser Assisted Bonding Technology
Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2023, pp.1-4 |
1 |
원문
|
|
Conference
|
2022 |
Epoxy based Solder Paste for Flexible Substrate with Laser Assisted Bonding Process
Jang Ki Seok Electronic System-Integration Technology Conference (ESTC) 2022, pp.28-30 |
2 |
원문
|
|
Journal
|
2021 |
Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining
Gwang-Mun Choi Polymers, v.13, no.6, pp.1-14 |
12 |
원문
|
|
Journal
|
2020 |
Epoxy-based Interconnection Materials and Process Technology Trends for Semiconductor Packaging
Eom Yong Sung 전자통신동향분석, v.35, no.4, pp.1-10 |
|
원문
|
|
Journal
|
2018 |
Crosslinkable deoxidizing hybrid adhesive of epoxy–diacid for electrical interconnections in semiconductor packaging
Keonsoo Jang Polymer International, v.67, no.9, pp.1241-1247 |
24 |
원문
|