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Conference
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2020 |
1700 V Full-SiC Half-bridge Power Module with Low Switching Loss
Jung Dong Yun Electronic System-Integration Technology Conference (ESTC) 2020, pp.1-4 |
1 |
원문
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Journal
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2020 |
Epoxy-based Interconnection Materials and Process Technology Trends for Semiconductor Packaging
Eom Yong Sung 전자통신동향분석, v.35, no.4, pp.1-10 |
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원문
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Journal
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2019 |
An Eco-friendly Flexible Piezoelectric Energy Harvester That Delivers High Output Performance is Based on Lead-free MASnI3 Films and MASnI3-PVDF Composite Films
Swathi Ippili Nano Energy, v.57, pp.911-923 |
122 |
원문
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Journal
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2016 |
Sn58Bi Solder Interconnection for Low-Temperature Flex-on-Flex Bonding
Haksun Lee ETRI Journal, v.38, no.6, pp.1163-1171 |
14 |
원문
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Conference
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2013 |
Thermally Activated Bumping Process using Sn3.0Ag0.5Cu Solder Powder for Low-Cost Interposers
Choi Kwang-Seong International Symposium on Microelectronics (IMAPS) 2013, pp.420-423 |
0 |
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Conference
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2012 |
Fine-Pitch, Low-Volume SoP(Solder-on-Pad) Process
Ho-Eun Bae Electronics Packaging Technology Conference (EPTC) 2012, pp.723-727 |
2 |
원문
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Conference
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2012 |
Novel Low-Volume Solder-on-Pad (SoP) Material and Process for Flip Chip Bonding Using Au Stud Bumps
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2012, pp.1919-1924 |
1 |
원문
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Journal
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2007 |
Structural and Dielectric Properties of Barium Stannate Titanate Thin Films for Microwave Tunable Devices and Multifunctional Sensors
Su Jae Lee Integrated Ferroelectrics, v.93, no.1, pp.141-147 |
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