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Journal
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2025 |
A semipermanently stable, photocrosslinkable graphene colloid: A fresh strategy for fabricating polymer nanocomposites
Park Seung Koo Composites Part A: Applied Science and Manufacturing, v.190, pp.1-9 |
0 |
원문
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Journal
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2024 |
Thermo-mechanical properties of shape-recoverable structural composites via vacuum-assisted resin transfer molding process and in-situ polymerization of poly (tert-butyl acrylate-co-acrylic acid) copolymer
전재경 Composites Part A: Applied Science and Manufacturing, v.185, pp.1-11 |
2 |
원문
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Conference
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2023 |
Anisotropic Solder Paste (ASP) Material Solution for Laser Assisted Bonding (LAB) Process
Jang Ki Seok European Microelectronics and Packaging Conference (EMPC) 2023, pp.1-4 |
0 |
원문
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Journal
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2020 |
Graphene-dispersed Polymer Waveguide for Efficient Formation of Mode-locked Lasers at Extremely Low Graphene Concentration
류보원 Carbon, v.166, pp.123-130 |
11 |
원문
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Journal
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2018 |
Reversible Thixotropic Gel Electrolytes for Safer and Shape-versatile Lithium-ion Batteries
Ju Young Kim Journal of Power Sources, v.401, pp.126-134 |
15 |
원문
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Journal
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2018 |
Reversible Thixotropic Gel Electrolytes for Safer and Shape-versatile Lithium-ion Batteries
Shin Dong Ok Journal of Power Sources, v.401, pp.126-134 |
15 |
원문
|
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Conference
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2015 |
Improved Dielectric Properties of 0-3 PZT/Epoxy Nanocomposite with Soft Polymer Matrix
Yeon Bora International Conference on Advanced Electromaterials (ICAE) 2015, pp.1-1 |
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|
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Conference
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2015 |
Isotropic Conductive Paste Based on Epoxy with Ag Coated Cu and SAC305 Solder
Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2015, pp.1-5 |
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|
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Conference
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2014 |
Maskless Screen Printing Technology for 20μm-Pitch, 52InSn Solder Interconnections in Display Applications
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2014, pp.1154-1159 |
8 |
원문
|
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Journal
|
2013 |
Imprintable, Bendable, and Shape‐Conformable Polymer Electrolytes for Versatile‐Shaped Lithium‐Ion Batteries
길은혜 Advanced Materials, v.25, no.10, pp.1390-1400 |
196 |
원문
|
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Conference
|
2012 |
Fine-Pitch, Low-Volume SoP(Solder-on-Pad) Process
Ho-Eun Bae Electronics Packaging Technology Conference (EPTC) 2012, pp.723-727 |
2 |
원문
|
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Journal
|
2012 |
N × N polymer matrix switches using thermo-optic total-internal-reflection switch
Han Young-Tak Optics Express, v.20, no.12, pp.13284-13295 |
29 |
원문
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Journal
|
2010 |
Chemo-Rheological Characteristics of a Self-Assembling Anisotropic Conductive Adhesive System Containing a Low-Melting Point Solder
백지원 Microelectronic Engineering, v.87, no.10, pp.1968-1972 |
32 |
원문
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Journal
|
2009 |
Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive)
임병승 Materials Transactions, v.50, no.7, pp.1684-1689 |
7 |
원문
|
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Journal
|
2008 |
Electrical and Mechanical Characterization of an Anisotropic Conductive Adhesive with a Low Melting Point Solder
Eom Yong Sung Microelectronic Engineering, v.85, no.11, pp.2202-2206 |
32 |
원문
|
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Journal
|
2008 |
Characterization of Polymer Matrix and Low Melting Point Solder for Anisotropic Conductive Film
Eom Yong Sung Microelectronic Engineering, v.85, no.2, pp.327-331 |
64 |
원문
|
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Conference
|
2004 |
The application of carbon nanotube - polymer composite as gas sensing materials
Seong-Mok Cho SENSORS 2004, pp.701-704 |
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원문
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