Subject

Subjects : Semiconductor packaging

  • Articles (10)
  • Patents (5)
  • R&D Reports (0)
논문 검색결과
Type Year Title Cited Download
Journal 2025 Reliability Enhancement of 30 μm-Pitch Interconnections via Room-Temperature Laser-Assisted Bonding with Compression (LABC) Using Optimized Laser Non-Conductive Paste (LNCP)   Lee Gaeun  Journal of Korean Institute of Metals and Materials, v.63, no.8, pp.583-593 0 원문
Conference 2020 Multi-layer Ceramic based Surface Mount Device Packaging for 1200 V and 1700 V SiC SBD Power Semiconductors   Jung Dong Yun  International Conference on Consumer Electronics (ICCE) 2020 : Asia, pp.603-606 4 원문
Journal 2020 Epoxy-based Interconnection Materials and Process Technology Trends for Semiconductor Packaging   Eom Yong Sung  전자통신동향분석, v.35, no.4, pp.1-10 원문
Conference 2019 Advanced Interconnection technology with Laser Assisted Bonding Process for PET Substrate   Eom Yong Sung  European Microelectronics and Packaging Conference (EMPC) 2019, pp.1-5 0 원문
Journal 2018 Crosslinkable deoxidizing hybrid adhesive of epoxy–diacid for electrical interconnections in semiconductor packaging   Keonsoo Jang  Polymer International, v.67, no.9, pp.1241-1247 24 원문
Journal 2018 Synchronous curable deoxidizing capability of epoxy–anhydride adhesive: Deoxidation quantification via spectroscopic analysis   Keonsoo Jang  Journal of Applied Polymer Science, v.135, no.33, pp.1-9 16 원문
Conference 2015 Isotropic Conductive Paste Based on Epoxy with Ag Coated Cu and SAC305 Solder   Eom Yong Sung  European Microelectronics and Packaging Conference (EMPC) 2015, pp.1-5
Conference 2014 Flip-Chip Bonding Processes with Low Volume SoP Technology   Eom Yong Sung  Electronic System-Integration Technology Conference (ESTC) 2014, pp.1-4 0 원문
Journal 2014 Characterization of Fluxing and Hybrid Underfills with Micro-encapsulated Catalyst for Long Pot Life   Eom Yong Sung  ETRI Journal, v.36, no.3, pp.343-351 35 원문
Journal 2013 Optimization of Material and Process for Fine Pitch LVSoP Technology   Eom Yong Sung  ETRI Journal, v.35, no.4, pp.625-631 21 원문
특허 검색결과
Status Year Patent Name Country Family Pat. KIPRIS
Registered 2023 APPARATUS AND METHOD FOR PROVIDING N6-LAN USING SERVICE FUNCTION CHAINING IN WIRELESS COMMUNICATION SYSTEM UNITED STATES
Registered 2022 다진법 연산을 수행하는 시냅스 소자 및 이를 포함하는 전자 회로 KOREA
Registered 2022 다진법 연산을 수행하는 시냅스 소자 및 이를 포함하는 전자 회로 KOREA
Registered 2023 METHOD AND APPARATUS FOR RESOURCE ALLOCATION CONTENTION IN DISTRIBUTED COMMUNICATION SYSTEM UNITED STATES
Registered 2022 METHOD OF SYNTHESIZING 3D JOINT DATA BASED ON MULTI-VIEW RGB-D CAMERA UNITED STATES
연구보고서 검색결과
Type Year Research Project Primary Investigator Download
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