Subjects :
Bonding technology
논문 검색결과
| Type |
Year |
Title |
Cited |
Download |
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Conference
|
2023 |
Process Window of Mini-LED Display Panel Packaging using Laser Assisted Bonding Technology
Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2023, pp.1-4 |
1 |
원문
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|
Conference
|
2023 |
Laser-Assisted Bonding with Compression (LABC) based Tiling Bonding Technology, Enabling Technology for Chiplet Integration
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2023, pp.1385-1389 |
5 |
원문
|
|
Journal
|
2022 |
MicroLED Transfer, Bonding, and Bad Pixel Repair Technology
Choi Kwang-Seong 전자통신동향분석, v.37, no.2, pp.53-61 |
|
원문
|
|
Journal
|
2020 |
Epoxy-based Interconnection Materials and Process Technology Trends for Semiconductor Packaging
Eom Yong Sung 전자통신동향분석, v.35, no.4, pp.1-10 |
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원문
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Conference
|
2020 |
Development of bonding process for flexible devices with fine-pitch interconnection using Anisotropic Solder Paste and Laser-Assisted Bonding Technology
Jiho Joo Electronic Components and Technology Conference (ECTC) 2020, pp.1309-1314 |
13 |
원문
|
|
Conference
|
2019 |
Enhanced Performance of Laser-Assisted Bonding with Compression (LABC) Compared with Thermal Compression Bonding (TCB) Technology
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2019, pp.197-203 |
24 |
원문
|
|
Journal
|
2015 |
Flexion Bonding Transfer of Multilayered Graphene as a Top Electrode in Transparent Organic Light-Emitting Diodes
Jong Tae Lim Scientific Reports, v.5, pp.1-11 |
31 |
원문
|
|
Conference
|
2015 |
Paper No S4.4: Colored OLED With a Multilayered Graphene Electrode for Light‐Adaptable Displays
Kwon Byoung-Hwa International Display Research Conference (EuroDisplay) 2015, pp.20-20 |
0 |
원문
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Conference
|
2014 |
Integration of Reflective Colored OLED for Light-adaptable Displays
Jong Tae Lim International Meeting on Information Display (IMID) 2014, pp.1-1 |
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Conference
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2012 |
Hybrid-Integrated Coherent Receiver Using Chip-to-Chip Bonding Technology
Jong-Hoi Kim Asia Communications and Photonics Conference (ACP) 2012, pp.1-4 |
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Conference
|
2011 |
Hybrid-integrated Coherent Receiver using Silica-based Planar Lightwave Circuit Technology
Kwon Yong-Hwan Asia Communications and Photonics Conference (ACP) 2011, pp.1-6 |
0 |
원문
|
특허 검색결과
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Year |
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Family Pat. |
KIPRIS |
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연구보고서 검색결과
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Year |
Research Project |
Primary Investigator |
Download |
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