Subjects :
thermal performance
논문 검색결과
| Type |
Year |
Title |
Cited |
Download |
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Journal
|
2017 |
The Carbon Wire Bundle’s Constructing as a Capillary Wick in the Flat Thin Heat Pipe
Moon Seok-Hwan Applied Thermal Engineering, v.126, pp.1177-1184 |
13 |
원문
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|
Conference
|
2017 |
Low-temperature Sintering Behavior of Ternary Solder and Copper Powder for High-Power Device Packaging
Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2017, pp.1-4 |
0 |
원문
|
|
Journal
|
2017 |
High Temperature Storage Test and Its Effect on the Thermal Stability and Electrical Characteristics of AlGaN/GaN High Electron Mobility Transistors
Jongmin Lee Current Applied Physics, v.17, no.2, pp.157-161 |
16 |
원문
|
|
Conference
|
2016 |
Thermal and Electrical Designs of RF 3D Module Based on Si Interposers with Redundant TSVs
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2016, pp.2051-2057 |
2 |
원문
|
|
Conference
|
2015 |
Development of a Cooling Technology for the Concentrating Solar Module with a Light Guide
Park Yoon Woo 대한설비공학회 학술 발표 대회 (하계) 2015, pp.882-885 |
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|
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Journal
|
2011 |
Development of a Flat-Plate Cooling Device for Electronic Packaging
Moon Seok-Hwan ETRI Journal, v.33, no.4, pp.645-647 |
6 |
원문
|
|
Journal
|
2010 |
Development of Small Flat Plate Type Cooling Device
Moon Seok-Hwan 설비공학논문집, v.22, no.9, pp.614-619 |
|
|
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Conference
|
2008 |
Fabrication and Characterization of Surface-Micromachined Compact Microheater for Gas Sensing Applications
Jaewoo Lee Conference on Nanotechnology (IEEE-NANO) 2008, pp.476-479 |
1 |
원문
|
|
Journal
|
2002 |
Improving Thermal Performance of Miniature Heat Pipe for Notebook PC Cooling
Moon Seok-Hwan Microelectronics Reliability, v.42, no.1, pp.135-140 |
71 |
원문
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특허 검색결과
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Family Pat. |
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연구보고서 검색결과
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