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Conference
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2024 |
Structural and Thermal Analysis of Ka-band Output Multiplexer and Feedback to Electrical Tuning
Kwak Changsoo Asia-Pacific Microwave Conference (APMC) 2024, pp.408-410 |
0 |
원문
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Conference
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2023 |
Analysis of Heat Dissipation Characteristics of Power Modules with Different Top Metal and Bottom Metal Thicknesses of Insulated Metal Substrate
박성효 대한전자공학회 학술 대회 (하계) 2023, pp.116-119 |
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Conference
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2021 |
Thermal and Electrical Reliability Analysis of TO-247 for Bonding Method, Substrate Structure and Heat Dissipation Bonding Material
Donghwan Kim Electronic Components and Technology Conference (ECTC) 2021, pp.1950-1956 |
5 |
원문
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Journal
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2021 |
Thermal analysis of 22.9-kV crosslinked polyethylene cable joint based on partial discharge using fiber Bragg grating sensors
Hyunjin Kim Optical Engineering, v.60, no.3, pp.1-8 |
11 |
원문
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Conference
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2020 |
Thermal analysis of power module using high heat dissipation substrate and bonding material
Donghwan Kim 대한전자공학회 학술 대회 (하계) 2020, pp.151-154 |
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Conference
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2018 |
Thermal Analysis of SiC Power Semiconductor with Copper Clip Bonding and Copper Sintering Paste
Inhoo Kim International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 2018, pp.1-4 |
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Conference
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2017 |
MR Images-Based Microwave Focusing for Thermal Therapy
Lee Kwang Jae Research in Adaptive and Convergent Systems (RACS) 2017, pp.126-131 |
3 |
원문
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Conference
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2014 |
Comparison Between Ka-band Antenna Thermal Analysis and Antenna In-Orbit Measured Temperatures
Jang-Sup Choi Joint Conference on Satellite Communications (JC-SAT) 2014, pp.1-6 |
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Journal
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2014 |
Thermal Analysis and Testing of a Heat Pipe With Woven Wired Wick
Moon Seok-Hwan IEEE Transactions on Components, Packaging, and Manufacturing Technology, v.4, no.6, pp.991-998 |
6 |
원문
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Journal
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2010 |
Chemo-Rheological Characteristics of a Self-Assembling Anisotropic Conductive Adhesive System Containing a Low-Melting Point Solder
백지원 Microelectronic Engineering, v.87, no.10, pp.1968-1972 |
32 |
원문
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Journal
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2010 |
Electrical Interconnection with a Smart ACA Composed of Fluxing Polymer and Solder Powder
Eom Yong Sung ETRI Journal, v.32, no.3, pp.414-421 |
52 |
원문
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Conference
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2006 |
Microfluidic Device Based on a Heat-Sensitive Poly(N-Isopropylacrylamide) Polymer for Controlled Patterning of Enzymes
Dae-Sik Lee International Meeting on Chemical Sensors (IMCS) 2006, pp.1-2 |
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Conference
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2006 |
Thermal Analysis and Performance in 1.55um Bottom-Emitting InAlGaAs VCSELs with Dielectric Mirror, Flip-Chip Bonded on Si-Substrate
Kim Jong Deog International Conference on Optical Internet and Next Generation Network (COIN-NGNCON) 2006, pp.355-357 |
0 |
원문
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