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Conference
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2024 |
Heat dissipation evaluation of epoxy-boron nitride-based non-conductive films with high thermal conductivity for fine-pitch solder bump interconnection
Oh Jin Hyuk European Materials Research Society (E-MRS) Meeting 2024 (Fall), pp.1-1 |
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Conference
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2021 |
Thermal and Electrical Reliability Analysis of TO-247 for Bonding Method, Substrate Structure and Heat Dissipation Bonding Material
Donghwan Kim Electronic Components and Technology Conference (ECTC) 2021, pp.1950-1956 |
5 |
원문
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Conference
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2020 |
Thermal analysis of power module using high heat dissipation substrate and bonding material
Donghwan Kim 대한전자공학회 학술 대회 (하계) 2020, pp.151-154 |
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Conference
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2020 |
Development of bonding process for flexible devices with fine-pitch interconnection using Anisotropic Solder Paste and Laser-Assisted Bonding Technology
Jiho Joo Electronic Components and Technology Conference (ECTC) 2020, pp.1309-1314 |
13 |
원문
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Journal
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2019 |
Efficiency Improvement of a DC/DC Converter using LTCC Substrate
Jung Dong Yun ETRI Journal, v.41, no.6, pp.811-819 |
8 |
원문
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Conference
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2019 |
GaN Device Technology for High Voltage and RF Power Application
Hyung Seok Lee 한러 과학기술의 날 2019, pp.1-1 |
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Journal
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2018 |
Technical Trends of Semiconductors for Harsh Environments
Woojin Chang 전자통신동향분석, v.33, no.6, pp.12-23 |
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원문
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Journal
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2017 |
Power Semiconductor SMD Package Embedded in Multilayered Ceramic for Low Switching Loss
Jung Dong Yun ETRI Journal, v.39, no.6, pp.866-873 |
12 |
원문
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Journal
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2017 |
Reconfigurable Yagi-Uda Antenna based on a Silicon Reflector with a Solid-State Plasma
박장순 Scientific Reports, v.7, pp.1-8 |
13 |
원문
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Journal
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2017 |
Reconfigurable Yagi-Uda Antenna based on a Silicon Reflector with a Solid-State Plasma
Kim Cheol Ho Scientific Reports, v.7, pp.1-8 |
13 |
원문
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Journal
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2017 |
Reconfigurable Yagi-Uda Antenna based on a Silicon Reflector with a Solid-State Plasma
김다진 Scientific Reports, v.7, pp.1-8 |
13 |
원문
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Conference
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2014 |
Development of a Heat Pipe Heat Dissipation Method for CPV Application
Moon Seok-Hwan International Conference on Concentrator Photovoltaic Systems (CPV) 2014, pp.140-143 |
4 |
원문
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Conference
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2011 |
Temperature Distribution Analysis of Silicon Nanowire for Thermoelectric Applications
Hyun Younghoon Nanotechnology Materials and Devices Conference (NMDC) 2011, pp.194-195 |
0 |
원문
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Conference
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2006 |
Numerical Analysis and IR Scan Test for Thermal Resistance of GaAs MMIC in a Communications Satellite
Kwak Changsoo Asia-Pacific Microwave Conference (APMC) 2006, pp.1011-1014 |
0 |
원문
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