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Conference
|
2014 |
Flip-Chip Bonding Processes with Low Volume SoP Technology
Eom Yong Sung Electronic System-Integration Technology Conference (ESTC) 2014, pp.1-4 |
0 |
원문
|
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Journal
|
2013 |
Fine‐Pitch Solder on Pad Process for Microbump Interconnection
Bae Hyun-Cheol ETRI Journal, v.35, no.6, pp.1152-1155 |
25 |
원문
|
|
Journal
|
2013 |
Optimization of Material and Process for Fine Pitch LVSoP Technology
Eom Yong Sung ETRI Journal, v.35, no.4, pp.625-631 |
21 |
원문
|
|
Journal
|
2013 |
Novel Bumping Process for Solder on Pad Technology
Choi Kwang-Seong ETRI Journal, v.35, no.2, pp.340-343 |
23 |
원문
|
|
Conference
|
2011 |
SoP(Solder on Pad) Technology with SBM(Solder Bump Maker) Material
Noh Jung Hyun 한국마이크로전자 및 패키징학회 학술 대회 (추계) 2011, pp.1-1 |
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