14ZB1400, ESSOP CUBE 기술 기반 차세대 레이더 3D 모듈 개발,
Lee Jin Ho
24PB1300, Technology of conductive interconnction material and mini LED package,
Eom Yong Sung
24JB2200, Development of electroplating materials for semiconductor high-density modules,
Eom Yong Sung
23PB1300, Technology of conductive interconnction material and mini LED package,
Eom Yong Sung
23JB2700, Development of electroplating materials for semiconductor high-density modules,
Eom Yong Sung
22PB3500, Technology of conductive interconnction material and mini LED package,
Eom Yong Sung
22JB1700, Development of electroplating materials for semiconductor high-density modules,
Eom Yong Sung
21PB2200, Technology of conductive interconnction material and mini LED package,
Eom Yong Sung
21JB3500, Development of electroplating materials for semiconductor high-density modules,
Eom Yong Sung
20PB4500, Technology of conductive interconnction material and mini LED package,
Eom Yong Sung
20PB2300, Eco-friendly Interconnection Paste and Process with Laser Bonding for Flexible LED Module,
Eom Yong Sung
20JB2300, Development of electroplating materials for semiconductor high-density modules,
Eom Yong Sung
19PB1700, Eco-friendly Interconnection Paste and Process with Laser Bonding for Flexible LED Module,
Eom Yong Sung
18PB3500, Eco-friendly Interconnection Paste and Process with Laser Bonding for Flexible LED Module,
Eom Yong Sung
18HB2100, One-stop Multi-functional Interconnection Material for Flip-chip bonding of ICT semiconductor device ,
Eom Yong Sung
17PB4100, Eco-friendly Interconnection Paste and Process with Laser Bonding for Flexible LED Module,
Eom Yong Sung
17HB2800, One-stop Multi-functional Interconnection Material for Flip-chip bonding of ICT semiconductor device ,
Eom Yong Sung
12MB3200, Development of advanced ultra thin MCP PCB Module & Embedded PCB SiP Module,
Eom Yong Sung
11MB4500, Development of advanced ultra thin MCP PCB Moudle & Embedded PCB SIP Moudle,
Eom Yong Sung
10MB5700, Development of advanced ultra thin MCP PCB Module & Embedded PCB SiP Module,
Eom Yong Sung
10MB4500, Hybrid underfill material for an electrical interconnection and high adhesion strength,
Eom Yong Sung
09MB4300, Hybrid underfill material for an electrical interconnection and high adhesion strength,
Eom Yong Sung
07MB3400, Anisotropic Conductive Material for IT Components,
Eom Yong Sung
06MB4100, Anisotropic Conductive Material for IT Components,
Eom Yong Sung
24ZB2200, Core technology for new microwave-reactive materials for low-carbon, high-quality semiconductor processing,
Choi Kwang-Seong
24JB1700, Development of multi-functional core materials of transfer and bonding process for micro LEDs,
Choi Kwang-Seong
23JB2900, Development of multi-functional core materials of transfer and bonding process for micro LEDs,
Choi Kwang-Seong
22PB2300, Development of thin photovoltaic module over 25% efficiency based on micro solar cells for mobile applications,
Choi Kwang-Seong
22JB1900, Development of multi-functional core materials of transfer and bonding process for micro LEDs,
Choi Kwang-Seong
21PB3300, Development of Equipment and Thermal Process Technology for Flexible Display and Devices,
Choi Kwang-Seong
21PB1100, Development of thin photovoltaic module over 25% efficiency based on micro solar cells for mobile applications,
Choi Kwang-Seong
21JB3200, Development of multi-functional core materials of transfer and bonding process for micro LEDs,
Choi Kwang-Seong
20PB3300, Development of Equipment and Thermal Process Technology for Flexible Display and Devices,
Choi Kwang-Seong
20PB1200, Development of thin photovoltaic module over 25% efficiency based on micro solar cells for mobile applications,
Choi Kwang-Seong
20JB3800, Development of multi-functional core materials of transfer and bonding process for micro LEDs,
Choi Kwang-Seong
19PB1600, Development of Equipment and Thermal Process Technology for Flexible Display and Devices,
Choi Kwang-Seong
19PB1100, Development of thin photovoltaic module over 25% efficiency based on micro solar cells for mobile applications,
Choi Kwang-Seong
18PB4100, Development of thin photovoltaic module over 25% efficiency based on micro solar cells for mobile applications,
Choi Kwang-Seong
18PB3900, Development of Equipment and Thermal Process Technology for Flexible Display and Devices,
Choi Kwang-Seong
18PB1600, Development of ultra precision stack bonding equipment for different packages using variable-area of laser,
Choi Kwang-Seong
17PB1300, Development of ultra precision stack bonding equipment for different packages using variable-area of laser,
Choi Kwang-Seong
16PB1900, Development of ultra precision stack bonding equipment for different packages using variable-area of laser,
Choi Kwang-Seong