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Conference
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2023 |
Analysis of Heat Dissipation Characteristics of Power Modules with Different Top Metal and Bottom Metal Thicknesses of Insulated Metal Substrate
박성효 대한전자공학회 학술 대회 (하계) 2023, pp.116-119 |
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Conference
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2022 |
Heat Dissipation Design of High-Power Wide-Bandgap Power Module with Insulated Metal Substrate
Jeong Bongmin International Conference and Exhibition on High Temperature Electronics Network (HiTEN) 2022, pp.66-70 |
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Conference
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2022 |
A Study on the Interfacial Reliability of Micro-nano Bimodal Cu Sintered Joints on DBC/AMB Substrates for Power Module
Son Kirak 한국반도체 학술대회 (KCS) 2022, pp.369-369 |
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Journal
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2021 |
Power Module Stray Inductance Extraction: Theoretical and Experimental Analysis
Jung Dong Yun ETRI Journal, v.43, no.5, pp.891-899 |
2 |
원문
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Conference
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2021 |
Thermal and Electrical Reliability Analysis of TO-247 for Bonding Method, Substrate Structure and Heat Dissipation Bonding Material
Donghwan Kim Electronic Components and Technology Conference (ECTC) 2021, pp.1950-1956 |
5 |
원문
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Conference
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2020 |
1700 V Full-SiC Half-bridge Power Module with Low Switching Loss
Jung Dong Yun Electronic System-Integration Technology Conference (ESTC) 2020, pp.1-4 |
1 |
원문
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Conference
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2020 |
Thermal analysis of power module using high heat dissipation substrate and bonding material
Donghwan Kim 대한전자공학회 학술 대회 (하계) 2020, pp.151-154 |
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Journal
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2019 |
Conductive adhesive with transient liquid‐phase sintering technology for high‐power device applications
Eom Yong Sung ETRI Journal, v.41, no.6, pp.820-828 |
10 |
원문
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Conference
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2019 |
Cu sintering paste for EV power module
Bae Hyun-Cheol International Conference on Advanced Electromaterials (ICAE) 2019, pp.1-1 |
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Conference
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2019 |
Sustainable Power Module for Implantable Medical Devices
Youm/Wooseup Gwangju International Interventional Cardiology Symposium (GICS) 2019, pp.1-17 |
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Conference
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2018 |
A Solution of Aluminum Flat Heat Pipe for Dry Cooling the Ladar Array
Suhyun Hong International Heat Transfer Conference (IHTC) 2018, pp.1-8 |
0 |
원문
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Conference
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2017 |
Low power and high density Microserver
Kwon Won-Ok 대한전자공학회 종합 학술 대회 (추계) 2017, pp.2557-2560 |
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Journal
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2016 |
High Performances of Metal-Substrate Power Module for Electrical Application
Kim Jongdae ETRI Journal, v.38, no.4, pp.645-653 |
0 |
원문
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Journal
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2015 |
Power Trench Gate MOSFET with an Integrated 6-Pack Configuration for a 3-Phase Inverter
Won Jong Il Journal of the Korean Physical Society, v.67, no.7, pp.1214-1221 |
2 |
원문
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Conference
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2015 |
Miniaturized Transmitter in Digital Modulation System with Non-constant Envelope for VHF Band
Kwon Heon Kook Progress in Electromagnetics Research Symposium (PIERS) 2015 in Prague, pp.210-213 |
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