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Conference
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2025 |
Localized Formation of Laser Non-conductive Film (NCF) on 10 μm Diameter Bumps, Applied to 20 μm Pitch Chiplet Chip-on-Wafer (CoW) Bonding
Shin Jungho Electronic Components and Technology Conference (ECTC) 2025, pp.1-6 |
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Conference
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2024 |
Heat dissipation evaluation of epoxy-boron nitride-based non-conductive films with high thermal conductivity for fine-pitch solder bump interconnection
Oh Jin Hyuk European Materials Research Society (E-MRS) Meeting 2024 (Fall), pp.1-1 |
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Conference
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2024 |
Laser Assisted Bonding (LAB) based Flip-chip process for fine pitch solder bumps device using Laser Non-Conductive Paste (NCP)
Jang Ki Seok Electronic System-Integration Technology Conference (ESTC) 2024, pp.1-4 |
0 |
원문
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Conference
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2024 |
Chip-on-Wafer (CoW) Technology Utilizing LaserAssisted Bonding with Compression (LABC) for Bump Counts Exceeding 500,000 at a 20m Pitch
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2024, pp.943-948 |
0 |
원문
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Conference
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2023 |
Anisotropic Solder Paste (ASP) Material Solution for Laser Assisted Bonding (LAB) Process
Jang Ki Seok European Microelectronics and Packaging Conference (EMPC) 2023, pp.1-4 |
0 |
원문
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Conference
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2022 |
Comparison of mini-LED bonding using ACF(Anisotropic conductive film) and ASF(Anisotropic solder film)
Lee Chanmi 한국마이크로전자 및 패키징학회 학술 대회 2022, pp.1-2 |
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Conference
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2019 |
Enhanced Performance of Laser-Assisted Bonding with Compression (LABC) Compared with Thermal Compression Bonding (TCB) Technology
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2019, pp.197-203 |
20 |
원문
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Conference
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2017 |
Solvent-free Fluxing Underfill Film for Electrical Interconnection
Keonsoo Jang European Microelectronics and Packaging Conference (EMPC) 2017, pp.1-4 |
3 |
원문
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Journal
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2017 |
Enhanced Electrical Properties of PEDOT:PSS Films using Solvent Treatment and its Application to ITO-free Organic Light-emitting Diodes
Joo Chul Woong Journal of Luminescence, v.187, pp.221-226 |
26 |
원문
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Journal
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2017 |
Enhanced Electrical Properties of PEDOT:PSS Films using Solvent Treatment and its Application to ITO-free Organic Light-emitting Diodes
Lee Jonghee Journal of Luminescence, v.187, pp.221-226 |
26 |
원문
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Journal
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2017 |
Enhanced Electrical Properties of PEDOT:PSS Films using Solvent Treatment and its Application to ITO-free Organic Light-emitting Diodes
서윤경 Journal of Luminescence, v.187, pp.221-226 |
26 |
원문
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Journal
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2016 |
Sn58Bi Solder Interconnection for Low-Temperature Flex-on-Flex Bonding
Haksun Lee ETRI Journal, v.38, no.6, pp.1163-1171 |
14 |
원문
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Conference
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2016 |
31-1: Novel Laminated OLEDs Using a Non-Metal Transparent Top Electrode with an Embedded Metal Mesh
박성희 Society for Information Display (SID) International Symposium 2016, pp.389-392 |
0 |
원문
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Conference
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2014 |
Development of Low Contact Resistance Interconnection for Display Applications
Haksun Lee Electronic System-Integration Technology Conference (ESTC) 2014, pp.1-5 |
4 |
원문
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Conference
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2013 |
Novel Interconnection Technology for Flex-on-Glass (FOG) Applications
Haksun Lee European Microelectronics and Packaging Conference (EMPC) 2013, pp.1-5 |
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Journal
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2011 |
Low-Temperature Synthesis of Thin Graphite Sheets Using Plasma-Assisted Thermal Chemical Vapor Deposition System
Byeong-Joo Lee Materials Letters, v.65, no.7, pp.1127-1130 |
13 |
원문
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Journal
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2010 |
Controlled Synthesis of Monolayer Graphene Toward Transparent Flexible Conductive Film Application
Byeong-Joo Lee Nanoscale Research Letters, v.5, no.11, pp.1768-1773 |
39 |
원문
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Journal
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2010 |
Electrical Interconnection with a Smart ACA Composed of Fluxing Polymer and Solder Powder
Eom Yong Sung ETRI Journal, v.32, no.3, pp.414-421 |
52 |
원문
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Journal
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2008 |
Characterization of Polymer Matrix and Low Melting Point Solder for Anisotropic Conductive Film
Eom Yong Sung Microelectronic Engineering, v.85, no.2, pp.327-331 |
64 |
원문
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