Subjects :
Packaging technology
논문 검색결과
| Type |
Year |
Title |
Cited |
Download |
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Journal
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2020 |
Epoxy-based Interconnection Materials and Process Technology Trends for Semiconductor Packaging
Eom Yong Sung 전자통신동향분석, v.35, no.4, pp.1-10 |
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원문
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Conference
|
2019 |
Enhanced Performance of Laser-Assisted Bonding with Compression (LABC) Compared with Thermal Compression Bonding (TCB) Technology
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2019, pp.197-203 |
20 |
원문
|
|
Journal
|
2017 |
Hidden Innovations in the Fourth Industrial Revolution: Electronic Packaging Technology
Choi Kwang-Seong 전자통신동향분석, v.32, no.6, pp.17-26 |
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원문
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Conference
|
2016 |
Temperature Dependence of Current-voltage Characteristics of Packaged AlGaN/GaN HEMT on SiC Substrate
Jongmin Lee 한국 반도체 학술 대회 (KCS) 2016, pp.1-2 |
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Journal
|
2010 |
Chemo-Rheological Characteristics of a Self-Assembling Anisotropic Conductive Adhesive System Containing a Low-Melting Point Solder
백지원 Microelectronic Engineering, v.87, no.10, pp.1968-1972 |
32 |
원문
|
|
Journal
|
2008 |
Electrical and Mechanical Characterization of an Anisotropic Conductive Adhesive with a Low Melting Point Solder
Eom Yong Sung Microelectronic Engineering, v.85, no.11, pp.2202-2206 |
32 |
원문
|
|
Journal
|
2008 |
Measurement of Dielectric Properties of LTCC Substrate and Transmission Characteristics of Transmission Lines on LTCC Substrate at 60 GHz
Kim Dong-Young Electronic Materials Letters, v.4, no.1, pp.35-38 |
|
|
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Conference
|
2003 |
Packaging technology for wavelength tunable filter based on optical MEMS
Eom Yong Sung IEEE LEOS International Conference on Optical MEMS 2003, pp.67-68 |
0 |
원문
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특허 검색결과
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Year |
Patent Name |
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Family Pat. |
KIPRIS |
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