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Conference
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2025 |
Selective Formation of Bonding Materials on Micro-bumps via Laser Non-conductive Film Dipping for 20 μm Pitch Interconnections
Shin Jungho International Symposium on Microelectronics and Packaging (ISMP) 2025, pp.1-18 |
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Conference
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2025 |
Reliability Analysis of Laser-Assisted Bonding with Compression (LABC) Using Non-Conductive Film (NCF) Containing Spherical h-BN Filler
Kim Seongcheol International Symposium on Microelectronics and Packaging (ISMP) 2025, pp.1-1 |
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Conference
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2025 |
Fine-Pitch Flip-Chip Bonding Process with Laser Non-Conductive Paste (NCP) and Laser-Assisted Bonding (LAB) for High-Reliability
Jang Ki Seok European Microelectronics and Packaging Conference (EMPC) 2025, pp.1-5 |
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원문
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Journal
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2025 |
Reliability Enhancement of 30 μm-Pitch Interconnections via Room-Temperature Laser-Assisted Bonding with Compression (LABC) Using Optimized Laser Non-Conductive Paste (LNCP)
Lee Gaeun Journal of Korean Institute of Metals and Materials, v.63, no.8, pp.583-593 |
0 |
원문
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Conference
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2025 |
Localized Formation of Laser Non-conductive Film (NCF) on 10 μm Diameter Bumps, Applied to 20 μm Pitch Chiplet Chip-on-Wafer (CoW) Bonding
Shin Jungho Electronic Components and Technology Conference (ECTC) 2025, pp.1-6 |
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Conference
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2024 |
Enhancing Reliability of 30μm-Pitch Interconnections Using Room Temperature Laser-Assisted Bonding with Compression (LABC) with Laser Non-Conductive Paste (LNCP)
Lee Gaeun International Symposium on Microelectronics and Packaging (ISMP) 2024, pp.1-14 |
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Conference
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2024 |
Laser Assisted Bonding (LAB) technology using Laser Non-Conductive Paste (NCP) for Micro solder bumps
Jang Ki Seok International Symposium on Microelectronics and Packaging (ISMP) 2024, pp.272-272 |
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Conference
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2024 |
Laser Assisted Bonding (LAB) based Flip-chip process for fine pitch solder bumps device using Laser Non-Conductive Paste (NCP)
Jang Ki Seok Electronic System-Integration Technology Conference (ESTC) 2024, pp.1-4 |
0 |
원문
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Conference
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2024 |
Heat dissipation evaluation of epoxy-boron nitride-based non-conductive films with high thermal conductivity for fine-pitch solder bump interconnection
Oh Jin Hyuk European Materials Research Society (E-MRS) Meeting 2024 (Fall), pp.1-1 |
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Conference
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2024 |
Chip-on-Wafer (CoW) Technology Utilizing LaserAssisted Bonding with Compression (LABC) for Bump Counts Exceeding 500,000 at a 20m Pitch
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2024, pp.943-948 |
2 |
원문
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Conference
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2019 |
Enhanced Performance of Laser-Assisted Bonding with Compression (LABC) Compared with Thermal Compression Bonding (TCB) Technology
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2019, pp.197-203 |
24 |
원문
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Journal
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2019 |
Characterization of Elastic Polymer-Based Smart Insole and a Simple Foot Plantar Pressure Visualization Method Using 16 Electrodes
Wangjoo Lee Sensors, v.19, no.1, pp.1-10 |
26 |
원문
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Conference
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2017 |
Silica Filler Content in NCP and its Effects on the Reliability of 3D TSV Multi-Stack under Thermal Shock Test
주니어 Electronics Packaging Technology Conference (EPTC) 2017, pp.1-8 |
8 |
원문
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Conference
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2017 |
Solvent-free Fluxing Underfill Film for Electrical Interconnection
Keonsoo Jang European Microelectronics and Packaging Conference (EMPC) 2017, pp.1-4 |
3 |
원문
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