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Journal
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2021 |
Compact Hybrid-Integrated 4 × 80-Gbps TROSA Module Using Optical Butt-Coupling of DML/SI-PD and Silica AWG Chips
Yun Seok Jun IEEE/OSA Journal of Lightwave Technology, v.39, no.8, pp.2468-2475 |
7 |
원문
|
|
Journal
|
2017 |
Cost-effective Parallel Optical Interconnection Module Based on Fully Passive-alignment Process
Son Dong Hoon Optical Engineering, v.56, no.11, pp.1-4 |
3 |
원문
|
|
Journal
|
2017 |
Integrated Flexible Electronic Devices Based on Passive Alignment for Physiological Measurement
Jin Hwa Ryu Sensors, v.17, no.4, pp.1-8 |
1 |
원문
|
|
Journal
|
2014 |
Fabrication of Low-Loss Optical Interconnected Waveguide Using a Replicated Seamless Large-area Polymeric Mold
Jin Hwa Ryu Journal of the Korean Physical Society, v.65, no.4, pp.450-456 |
2 |
원문
|
|
Journal
|
2010 |
Low-Cost Coaxial-Type Single TO-can Bidirectional Optical Subassembly
Lim Kwon-Seob Electronics Letters, v.46, no.23, pp.1556-1557 |
10 |
원문
|
|
Journal
|
2009 |
Design and Fabrication of 1.25-Gb/s Full-Triplex Transceiver Module With PLC on a Lossy Si Substrate for G/E-PONs
Kim Sungil Journal of Lightwave Technology, v.27, no.6, pp.679-687 |
0 |
원문
|
|
Journal
|
2006 |
Simultaneous Optical/Electrical Interconnection of Polymer Planar-Lightwave-Circuit Chip based on Polymer MOEMS and Replication Technology
Jin Tae Kim Sensors and Actuators A : Physical, v.126, no.2, pp.425-429 |
8 |
원문
|
|
Journal
|
2005 |
Fabrication Process for Polymer PLC Platforms with V-Grooves for Passive Alignment
Park Suntak Optics Communications, v.256, no.1-3, pp.108-113 |
1 |
원문
|
|
Journal
|
2005 |
A High-Density Two-Dimensional Parallel Optical Interconnection Module
Han Sang-Pil IEEE Photonics Technology Letters, v.17, no.11, pp.2448-2450 |
19 |
원문
|
|
Journal
|
2005 |
Fabrication Method for Passive Alignment in Polymer PLCs With U-Grooves
Park Suntak IEEE Photonics Technology Letters, v.17, no.7, pp.1444-1446 |
9 |
원문
|
|
Journal
|
2004 |
Passive alignment method of polymer PLC devices by using a hot embossing technique
Jin Tae Kim IEEE Photonics Technology Letters, v.16, no.7, pp.1664-1666 |
39 |
원문
|