Subjects :
Conductive paste
논문 검색결과
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Year |
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Cited |
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Conference
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2025 |
Fine-Pitch Flip-Chip Bonding Process with Laser Non-Conductive Paste (NCP) and Laser-Assisted Bonding (LAB) for High-Reliability
Jang Ki Seok European Microelectronics and Packaging Conference (EMPC) 2025, pp.1-5 |
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원문
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Journal
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2025 |
Reliability Enhancement of 30 μm-Pitch Interconnections via Room-Temperature Laser-Assisted Bonding with Compression (LABC) Using Optimized Laser Non-Conductive Paste (LNCP)
Lee Gaeun Journal of Korean Institute of Metals and Materials, v.63, no.8, pp.583-593 |
0 |
원문
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Conference
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2024 |
Enhancing Reliability of 30μm-Pitch Interconnections Using Room Temperature Laser-Assisted Bonding with Compression (LABC) with Laser Non-Conductive Paste (LNCP)
Lee Gaeun International Symposium on Microelectronics and Packaging (ISMP) 2024, pp.1-14 |
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Conference
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2024 |
Laser Assisted Bonding (LAB) technology using Laser Non-Conductive Paste (NCP) for Micro solder bumps
Jang Ki Seok International Symposium on Microelectronics and Packaging (ISMP) 2024, pp.272-272 |
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Conference
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2024 |
Laser Assisted Bonding (LAB) based Flip-chip process for fine pitch solder bumps device using Laser Non-Conductive Paste (NCP)
Jang Ki Seok Electronic System-Integration Technology Conference (ESTC) 2024, pp.1-4 |
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원문
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Conference
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2023 |
Anisotropic Solder Paste (ASP) Material Solution for Laser Assisted Bonding (LAB) Process
Jang Ki Seok European Microelectronics and Packaging Conference (EMPC) 2023, pp.1-4 |
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원문
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Conference
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2017 |
Silica Filler Content in NCP and its Effects on the Reliability of 3D TSV Multi-Stack under Thermal Shock Test
주니어 Electronics Packaging Technology Conference (EPTC) 2017, pp.1-8 |
8 |
원문
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Conference
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2017 |
Low-temperature Sintering Behavior of Ternary Solder and Copper Powder for High-Power Device Packaging
Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2017, pp.1-4 |
0 |
원문
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Conference
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2015 |
Cost-Effective Thermoelectric Cooler Module Using Isotropic Conductive Paste Based on Epoxy with Ag Coated Cu and Solder
Bae Hyun-Cheol International Symposium on Microelectronics and Packaging (ISMP) 2015, pp.136-136 |
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Conference
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2015 |
Electrically Conductive Paste with Copper for Flexible Packaging Application
Eom Yong Sung International Symposium on Microelectronics and Packaging (ISMP) 2015, pp.144-144 |
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Conference
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2015 |
Isotropic Conductive Paste Based on Epoxy with Ag Coated Cu and SAC305 Solder
Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2015, pp.1-5 |
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연구보고서 검색결과
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