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Journal
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2025 |
Reliability Enhancement of 30 μm-Pitch Interconnections via Room-Temperature Laser-Assisted Bonding with Compression (LABC) Using Optimized Laser Non-Conductive Paste (LNCP)
Lee Gaeun Journal of Korean Institute of Metals and Materials, v.63, no.8, pp.583-593 |
0 |
원문
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Journal
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2018 |
Mechanics and Rheology of Basalt Fiber-Reinforced Polycarbonate Composites
Keonsoo Jang Polymer, v.147, pp.133-141 |
60 |
원문
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Journal
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2018 |
Versatile Epoxy/Phenoxy/Anhydride-Based Hybrid Adhesive Films for Deoxidization and Electrical Interconnection
Keonsoo Jang Industrial & Engineering Chemistry Research, v.57, no.21, pp.7181-7187 |
11 |
원문
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Journal
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2016 |
Curing Kinetics and Chemorheological Behavior of No-flow Underfill for Sn/In/Bi Solder in Flexible Packaging Applications
Eom Yong Sung ETRI Journal, v.38, no.6, pp.1179-1189 |
5 |
원문
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Conference
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2014 |
Flip-Chip Bonding Processes with Low Volume SoP Technology
Eom Yong Sung Electronic System-Integration Technology Conference (ESTC) 2014, pp.1-4 |
0 |
원문
|
|
Journal
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2014 |
Characterization of Fluxing and Hybrid Underfills with Micro-encapsulated Catalyst for Long Pot Life
Eom Yong Sung ETRI Journal, v.36, no.3, pp.343-351 |
35 |
원문
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|
Journal
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2013 |
The Observation of Electrical Hysteric Behavior in Synthesized V2O5 Nanoplates by Recrystallization
김창희 Journal of Nanomaterials, v.2013, pp.1-8 |
4 |
원문
|
|
Journal
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2013 |
Optimization of Material and Process for Fine Pitch LVSoP Technology
Eom Yong Sung ETRI Journal, v.35, no.4, pp.625-631 |
21 |
원문
|
|
Conference
|
2012 |
Fine-Pitch, Low-Volume SoP(Solder-on-Pad) Process
Ho-Eun Bae Electronics Packaging Technology Conference (EPTC) 2012, pp.723-727 |
2 |
원문
|
|
Journal
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2010 |
Chemo-Rheological Characteristics of a Self-Assembling Anisotropic Conductive Adhesive System Containing a Low-Melting Point Solder
백지원 Microelectronic Engineering, v.87, no.10, pp.1968-1972 |
32 |
원문
|
|
Journal
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2009 |
A New Poly(thienylenevinylene) Derivative with High Mobility and Oxidative Stability for Organic Thin‐Film Transistors and Solar Cells
임보규 Advanced Materials, v.21, no.27, pp.2808-2814 |
124 |
원문
|
|
Journal
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2009 |
Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive)
임병승 Materials Transactions, v.50, no.7, pp.1684-1689 |
7 |
원문
|
|
Journal
|
2008 |
Characterization of Polymer Matrix and Low Melting Point Solder for Anisotropic Conductive Film
Eom Yong Sung Microelectronic Engineering, v.85, no.2, pp.327-331 |
64 |
원문
|
|
Journal
|
2007 |
Microscopic Behavior of Sb in Chalcogenide Materials for Crystallization Process
Ryu Hojun Materials Science and Engineering A, v.449-451, pp.573-577 |
1 |
원문
|
|
Journal
|
2006 |
Relationship between the liquid crystallinity and field‐effect‐transistor behavior of fluorene–thiophene‐based conjugated copolymers
임은희 Journal of Polymer Science Part A : Polymer Chemistry, v.44, no.16, pp.4709-4721 |
52 |
원문
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