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Conference
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2025 |
Environmentally Friendly Cu Post Technology Based on Laser-Assisted Bonding with Compression (LABC) and Fume-Free Laser Solder Paste for Advanced 3D Interconnections
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2025, pp.1952-1957 |
0 |
원문
|
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Conference
|
2023 |
Anisotropic Solder Paste (ASP) Material Solution for Laser Assisted Bonding (LAB) Process
Jang Ki Seok European Microelectronics and Packaging Conference (EMPC) 2023, pp.1-4 |
1 |
원문
|
|
Conference
|
2023 |
Development of a highly reliable Mini-LED display module using simultaneous transfer and bonding (SITRAB) technology
Jiho Joo Society for Information Display (SID) International Symposium 2023, pp.433-436 |
3 |
원문
|
|
Conference
|
2022 |
Epoxy based Solder Paste for Flexible Substrate with Laser Assisted Bonding Process
Jang Ki Seok Electronic System-Integration Technology Conference (ESTC) 2022, pp.28-30 |
2 |
원문
|
|
Conference
|
2021 |
Development of simultaneous transferring and bonding (SITRAB) process for µLED arrays using Anisotropic Solder Paste (ASP) and Laser-Assisted Bonding (LAB) Technology
Jiho Joo Electronic Components and Technology Conference (ECTC) 2021, pp.687-692 |
5 |
원문
|
|
Journal
|
2021 |
Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining
Gwang-Mun Choi Polymers, v.13, no.6, pp.1-14 |
14 |
원문
|
|
Conference
|
2020 |
Development of bonding process for flexible devices with fine-pitch interconnection using Anisotropic Solder Paste and Laser-Assisted Bonding Technology
Jiho Joo Electronic Components and Technology Conference (ECTC) 2020, pp.1309-1314 |
13 |
원문
|
|
Conference
|
2019 |
Advanced Interconnection technology with Laser Assisted Bonding Process for PET Substrate
Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2019, pp.1-5 |
0 |
원문
|
|
Journal
|
2017 |
Integrated Flexible Electronic Devices Based on Passive Alignment for Physiological Measurement
Jin Hwa Ryu Sensors, v.17, no.4, pp.1-8 |
1 |
원문
|
|
Journal
|
2015 |
Epoxy Solder Paste and Its Applications
문종태 대한용접·접합학회지, v.33, no.3, pp.32-39 |
|
원문
|
|
Journal
|
2014 |
Characterization and Estimation of Solder-on-Pad Process for Fine-Pitch Applications
Haksun Lee IEEE Transactions on Components, Packaging, and Manufacturing Technology, v.4, no.10, pp.1729-1738 |
15 |
원문
|
|
Conference
|
2014 |
Development of Low Contact Resistance Interconnection for Display Applications
Haksun Lee Electronic System-Integration Technology Conference (ESTC) 2014, pp.1-5 |
5 |
원문
|