Conference
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2025 |
An Analysis of DDR Channel Signal Integrity on a High-Performance Computing Mainboard
Lee Kyong Hee International Conference on Advanced Communications Technology (ICACT) 2025, pp.431-434 |
0 |
원문
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Conference
|
2024 |
Channel Validations for Transport Network System
Choi Woo Young International Conference on Information and Communication Technology Convergence (ICTC) 2024, pp.1089-1093 |
0 |
원문
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Conference
|
2023 |
A Signal Integrity Analysis for the Design of a Computer Mainboard
Lee Kyong Hee International Conference on Consumer Electronics (ICCE) 2023 : Asia, pp.380-382 |
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Conference
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2023 |
Chiplet Heterogeneous-Integration AI Processor
Kwon Young-Su International Conference on Electronics, Information and Communication (ICEIC) 2023, pp.1-2 |
9 |
원문
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Journal
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2019 |
Signal integrity analysis of system interconnection module of high‐density server supporting serial RapidIO
Kwon Hyuk Je ETRI Journal, v.41, no.5, pp.670-683 |
6 |
원문
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Conference
|
2018 |
High-Speed Signal Integrity Design for HDCA Systems
Kwon Won-Ok International Conference on Information and Communication Technology Convergence (ICTC) 2018, pp.1267-1269 |
1 |
원문
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Conference
|
2017 |
Comparison BER with the Different Stack-Up PCB of KOSMOS Micro-Server System Interconnection Module Supporting 800Gbps Bandwidth
Kwon Hyuk Je International Conference on Information Technology (ICIT) 2017, pp.201-205 |
0 |
원문
|
Conference
|
2017 |
BER Comparison Depending on the Different Stack-Up of System Interconnection Modules on KOSMOS Micro-Server
Kwon Hyuk Je 대한전자공학회 종합 학술 대회 (추계) 2017, pp.172-175 |
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Conference
|
2016 |
Signal Integrity Analysis for Micorserver Backplane Prototype
Kwon Won-Ok International Conference on Information and Communication Technology Convergence (ICTC) 2016, pp.791-793 |
0 |
원문
|
Conference
|
2015 |
PCI Express Gen3 Switch Card Development by Using High-Speed Signal Integrity Analysis
Kwon Won-Ok International Conference on Electronics, Information and Communication (ICEIC) 2015, pp.547-550 |
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Conference
|
2014 |
PCI Express Gen3 System Switch Card Development Using High-Speed Signal Integrity Analysis
Kwon Won-Ok 대한전자공학회 종합 학술 대회 (하계) 2014, pp.1491-1494 |
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Conference
|
2013 |
A Compact ROSA Module for Serial 40-Gb/s Optical Transceiver
Kang Sae-Kyoung Electronic Components and Technology Conference (ECTC) 2013, pp.1850-1854 |
2 |
원문
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Conference
|
2013 |
Si-interposer Design for GPU-Memory Integration concerning the Signal Integrity
조종현 DesignCon 2013, pp.1-20 |
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Conference
|
2012 |
Enhanced EBG-Patterned Power/Ground Plane Structures for Suppressing Power Plane Noises
Kwon Jong Hwa International European Symposium on Electromagnetic Compatibility (EMC Europe) 2012, pp.1-4 |
1 |
원문
|
Conference
|
2010 |
Design of Parallel Scrambler in High-speed Serial Protocol
Kwon Won-Ok International Technical Conference on Circuits/Systems, Computers and Communications (ITC-CSCC) 2010, pp.59-62 |
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Journal
|
2010 |
Novel Electromagnetic Bandgap Array Structure on Power Distribution Network for Suppressing Simultaneous Switching Noise and Minimizing Effects on High-Speed Signals
Kwon Jong Hwa IEEE Transactions on Electromagnetic Compatibility, v.52, no.2, pp.365-372 |
55 |
원문
|
Conference
|
2008 |
Partial EBG Placement on PDN to Effectively Suppress Simultaneous Switching Noise
Kwon Jong Hwa Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) 2008, pp.89-92 |
2 |
원문
|
Conference
|
2007 |
Signal Integrity of PCI Express System
Kwon Won-Ok International Technical Conference on Circuits/Systems, Computers and Communications (ITC-CSCC) 2007, pp.872-873 |
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Conference
|
2005 |
Guaranteed Passive Coupled-Microstrip Interconnect Modeling Using Finite Element Method
Se-Ho You IEEE MTT-S International Microwave Symposium 2005, pp.1431-1434 |
2 |
원문
|
Conference
|
2004 |
Effective Digital IO Pin Modeling Methodology Based on IBIS Model
Kwon Won Ok Asian Simulation Conference (AsiaSim) 2004 (LNAI 3398), v.3398, pp.721-730 |
1 |
원문
|
Journal
|
2003 |
An Effect of Electrical Interconnect in Optical Transceiver Module
Cho In Kui 한국전자파학회논문지, v.14, no.8, pp.863-870 |
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