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Journal
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2019 |
Disaggregated Cloud Memory with Elastic Block Management
Koh Kwang-Won IEEE Transactions on Computers, v.68, no.1, pp.39-52 |
23 |
원문
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Journal
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2015 |
Novel Low-Volume Solder-on-Pad Process for Fine Pitch Cu Pillar Bump Interconnection
Bae Hyun-Cheol 한국마이크로전자 및 패키징학회지, v.22, no.2, pp.55-59 |
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원문
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Conference
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2014 |
Flip-Chip Bonding Processes with Low Volume SoP Technology
Eom Yong Sung Electronic System-Integration Technology Conference (ESTC) 2014, pp.1-4 |
0 |
원문
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Conference
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2013 |
Novel Low-Volume Solder-on-Pad for Fine-Pitch Cu Pillar Bump
Bae Hyun-Cheol European Microelectronics and Packaging Conference (EMPC) 2013, pp.1-4 |
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Journal
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2013 |
Optimization of Material and Process for Fine Pitch LVSoP Technology
Eom Yong Sung ETRI Journal, v.35, no.4, pp.625-631 |
21 |
원문
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Journal
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2013 |
Novel Bumping Process for Solder on Pad Technology
Choi Kwang-Seong ETRI Journal, v.35, no.2, pp.340-343 |
23 |
원문
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Conference
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2012 |
Fine-Pitch, Low-Volume SoP(Solder-on-Pad) Process
Ho-Eun Bae Electronics Packaging Technology Conference (EPTC) 2012, pp.723-727 |
2 |
원문
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Journal
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2012 |
Novel Bumping and Underfill Technologies for 3D IC integration
성기준 ETRI Journal, v.34, no.5, pp.706-712 |
31 |
원문
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Conference
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2012 |
3D SiP Module Using TSV and Novel Low-Volume Solder-on-Pad(SoP) Process
Bae Hyun-Cheol Electronic System-Integration Technology Conference (ESTC) 2012, pp.1-4 |
1 |
원문
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Conference
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2012 |
Novel Low-Volume Solder-on-Pad (SoP) Material and Process for Flip Chip Bonding Using Au Stud Bumps
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2012, pp.1919-1924 |
1 |
원문
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Conference
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2011 |
Low-volume Solder-on-Pad Technology for 3D IC Integration
Ho-Eun Bae 한국마이크로전자 및 패키징학회 학술 대회 (추계) 2011, pp.1-1 |
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Conference
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2011 |
Bumping and Stacking Processes for 3D IC using Fluxfree Polymer
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2011, pp.1746-1751 |
3 |
원문
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Conference
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2010 |
Solder Bump Maker with Coining Process on TSV Chips for 3D Packages
성기준 International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP) 2010, pp.185-189 |
4 |
원문
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Journal
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2010 |
Novel Maskless Bumping for 3D Integration
Choi Kwang-Seong ETRI Journal, v.32, no.2, pp.342-344 |
37 |
원문
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