Subject

Subjects : melting point

  • Articles (12)
  • Patents (9)
  • R&D Reports (0)
논문 검색결과
Type Year Title Cited Download
Journal 2018 Exploring Polyethylene/Polypropylene Nonwoven Fabrics Derived from Two-Dimensionally Co-Extruded Composites: Effects of Delamination, Consolidation, Drawing and Nanoparticle Incorporation on Mechanics, Pore Size and Permeability   Keonsoo Jang  Composites Science and Technology, v.165, pp.380-387 12 원문
Journal 2017 Fluoropolymer-Based Flexible Neural Prosthetic Electrodes for Reliable Neural Interfacing   Kim Yong Hee  ACS Applied Materials & Interfaces, v.9, no.50, pp.43420-43428 8 원문
Conference 2014 Development of Low Contact Resistance Interconnection for Display Applications   Haksun Lee  Electronic System-Integration Technology Conference (ESTC) 2014, pp.1-5 4 원문
Conference 2014 Maskless Screen Printing Technology for 20μm-Pitch, 52InSn Solder Interconnections in Display Applications   Choi Kwang-Seong  Electronic Components and Technology Conference (ECTC) 2014, pp.1154-1159 8 원문
Journal 2013 Novel Bumping Process for Solder on Pad Technology   Choi Kwang-Seong  ETRI Journal, v.35, no.2, pp.340-343 23 원문
Journal 2010 Chemo-Rheological Characteristics of a Self-Assembling Anisotropic Conductive Adhesive System Containing a Low-Melting Point Solder   백지원  Microelectronic Engineering, v.87, no.10, pp.1968-1972 32 원문
Journal 2010 Novel Maskless Bumping for 3D Integration   Choi Kwang-Seong  ETRI Journal, v.32, no.2, pp.342-344 37 원문
Conference 2009 Novel Bumping Material for Stacking Silicon Chips   Choi Kwang-Seong  Electronics Packaging Technology Conference (EPTC) 2009, pp.579-583 2 원문
Journal 2009 Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive)   임병승  Materials Transactions, v.50, no.7, pp.1684-1689 7 원문
Journal 2008 Electrical and Mechanical Characterization of an Anisotropic Conductive Adhesive with a Low Melting Point Solder   Eom Yong Sung  Microelectronic Engineering, v.85, no.11, pp.2202-2206 32 원문
Journal 2008 Characterization of Polymer Matrix and Low Melting Point Solder for Anisotropic Conductive Film   Eom Yong Sung  Microelectronic Engineering, v.85, no.2, pp.327-331 64 원문
Journal 2007 Polyaniline Doped with Dimethyl Sulfate as a Nucleophilic Dopant and Its Electrochemical Properties as an Electrode in a Lithium Secondary Battery and a Redox Supercapacitor   Ryu Kwang Sun  The Journal of Physical Chemistry B, v.111, no.4, pp.731-739 85 원문
특허 검색결과
Status Year Patent Name Country Family Pat. KIPRIS
Registered 2016 3D printed jewelry fabrication and a method for manufacturing the same UNITED STATES
Registered 2016 METAL MATERIAL FOR 3-DIMENSIONAL PRINTING, METHOD FOR MANUFACTURING THE SAME, AND METHOD FOR 3-DIMENSIONAL PRINTING USING THE SAME CHINA
Registered 2016 3D printed device fabrication and a method for manufacturing the same UNITED STATES
Registered 2013 METHOD OF FORMING SOLDER ON PAD ON FINE PITCH PCB AND METHOD OF FLIP CHIP BONDING SEMICONDUCTOR USING THE SAME UNITED STATES
Registered 2009 METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING THE SAME UNITED STATES
Registered 2013 COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING THE SAME UNITED STATES
Registered 2014 COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING THE SAME UNITED STATES
Registered 2014 COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING THE SAME UNITED STATES
Registered 2009 COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING THE SAME UNITED STATES
연구보고서 검색결과
Type Year Research Project Primary Investigator Download
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